scholarly journals A novel on-chip three-dimensional micromachined calorimeter with fully enclosed and suspended thin-film chamber for thermal characterization of liquid samples

2014 ◽  
Vol 8 (3) ◽  
pp. 034101 ◽  
Author(s):  
Benyamin Davaji ◽  
Hye Jeong Bak ◽  
Woo-Jin Chang ◽  
Chung Hoon Lee
Author(s):  
Giulia Petrucci ◽  
Domenico Caputo ◽  
Augusto Nascetti ◽  
Nicola Lovecchio ◽  
Emanuele Parisi ◽  
...  

2018 ◽  
Vol 1 (1) ◽  
pp. 1-11 ◽  
Author(s):  
Kamaljit Singh Boparai ◽  
Rupinder Singh

This study highlights the thermal characterization of ABS-Graphene blended three dimensional (3D) printed functional prototypes by fused deposition modeling (FDM) process. These functional prototypes have some applications as electro-chemical energy storage devices (EESD). Initially, the suitability of ABS-Graphene composite material for FDM applications has been examined by melt flow index (MFI) test. After establishing MFI, the feedstock filament for FDM has been prepared by an extrusion process. The fabricated filament has been used for printing 3D functional prototypes for printing of in-house EESD. The differential scanning calorimeter (DSC) analysis was conducted to understand the effect on glass transition temperature with the inclusion of Graphene (Gr) particles. It has been observed that the reinforced Gr particles act as a thermal reservoir (sink) and enhances its thermal/electrical conductivity. Also, FT-IR spectra realized the structural changes with the inclusion of Gr in ABS matrix. The results are supported by scanning electron microscopy (SEM) based micrographs for understanding the morphological changes.


Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 776 ◽  
Author(s):  
Bogdan F. Spiridon ◽  
Peter H. Griffin ◽  
John C. Jarman ◽  
Yingjun Liu ◽  
Tongtong Zhu ◽  
...  

This study focuses on the thermal characterization of porous gallium nitride (GaN) usingan extended 3ω method. Porous semiconductor materials provide a solution to the need for on-chipthermal insulation, a fundamental requirement for low-power, high-speed and high-accuracythermal sensors. Thermal insulation is especially important in GaN devices, due to the intrinsicallyhigh thermal conductivity of the material. The results show one order of magnitude reduction inthermal conductivity, from 130 W/mK to 10 W/mK, in line with theoretical predictions for porousmaterials. This achievement is encouraging in the quest for integrating sensors with opto-, powerandRF-electronics on a single GaN chip.


2019 ◽  
Vol 31 (8) ◽  
pp. 1779-1784
Author(s):  
V. Mohanraj ◽  
R. Pavithra ◽  
M. Thenmozhi ◽  
R. Umarani

Phenyl trimethylammonium tetrachlorocobaltate, crystals were grown by slow evaporation technique. The crystal was bright, transparent. The three dimensional structure of the phenyl trimethylammonium tetrachlorocobaltate was obtained from single crystal X-ray diffraction studies. The molecule belongs to monoclinic crystal system with C2/c space group. The presence of functional groups and modes of vibrations were identified by FT-IR spectroscopy. 1H NMR spectroscopy was also used to characterise the compound and the thermal stability of the crystal was established by TGA/DT analysis. This work undergoes phase transition which makes the study interesting.


2015 ◽  
Vol 64 (5) ◽  
pp. 1098-1098 ◽  
Author(s):  
Andrea Scorzoni ◽  
Michele Tavernelli ◽  
Pisana Placidi ◽  
Stefano Zampolli

Materials ◽  
2019 ◽  
Vol 12 (11) ◽  
pp. 1740 ◽  
Author(s):  
Yifeng Fu ◽  
Guofeng Cui ◽  
Kjell Jeppson

The design, fabrication, and use of a hotspot-producing and temperature-sensing resistance thermometer for evaluating the thermal properties of low-dimensional materials are described in this paper. The materials that are characterized include one-dimensional (1D) carbon nanotubes, and two-dimensional (2D) graphene and boron nitride films. The excellent thermal performance of these materials shows great potential for cooling electronic devices and systems such as in three-dimensional (3D) integrated chip-stacks, power amplifiers, and light-emitting diodes. The thermometers are designed to be serpentine-shaped platinum resistors serving both as hotspots and temperature sensors. By using these thermometers, the thermal performance of the abovementioned emerging low-dimensional materials was evaluated with high accuracy.


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