In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

2014 ◽  
Vol 115 (7) ◽  
pp. 074305 ◽  
Author(s):  
K. Vanstreels ◽  
P. Czarnecki ◽  
T. Kirimura ◽  
Y. K. Siew ◽  
I. De Wolf ◽  
...  
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