Composition and crystallinity in electrochemically deposited magnetostrictive galfenol (FeGa)

2014 ◽  
Vol 115 (17) ◽  
pp. 17A918 ◽  
Author(s):  
Eliot C. Estrine ◽  
Matt Hein ◽  
William P. Robbins ◽  
Bethanie J. H. Stadler
Keyword(s):  
Electrochemically Deposited ◽  
Magnetostrictive Galfenol

Osteoclast and osteoblast response to strontium-doped struvite coatings on titanium for improved bone integration

2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Claus Moseke ◽  
Katharina Wimmer ◽  
Markus Meininger ◽  
Julia Zerweck ◽  
Cornelia Wolf-Brandstetter ◽  
...  
Keyword(s):  
Bone Ingrowth ◽  
Osteoclast Differentiation ◽  
Inhibitory Effect ◽  
Osteoclast Formation ◽  
Strontium Nitrate ◽  
Bone Implant ◽  
Electrochemically Deposited ◽  
Bone Integration ◽  
Titanium Substrates

AbstractTo develop implants with improved bone ingrowth, titanium substrates were coated with homogeneous and dense struvite (MgNH4PO4·6H2O) layers by means of electrochemically assisted deposition. Strontium nitrate was added to the coating electrolyte in various concentrations, in order to fabricate Sr-doped struvite coatings with Sr loading ranging from 10.6 to 115 μg/cm2. It was expected and observed that osteoclast activity surrounding the implant was inhibited. The cytocompatibility of the coatings and the effect of Sr-ions in different concentrations on osteoclast formation were analyzed in vitro. Osteoclast differentiation was elucidated on morphological, biochemical as well as on gene expression level. It could be shown that moderate concentrations of Sr2+ had an inhibitory effect on osteoclast formation, while the growth of osteoblastic cells was not negatively influenced compared to pure struvite surfaces. In summary, the electrochemically deposited Sr-doped struvite coatings are a promising approach to improve bone implant ingrowth.

scholarly journals Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 111
Author(s):  
Ivana O. Mladenović ◽  
Nebojša D. Nikolić ◽  
Jelena S. Lamovec ◽  
Dana Vasiljević-Radović ◽  
Vesna Radojević
Keyword(s):  
Mechanical Characteristics ◽  
Dislocation Creep ◽  
Average Current Density ◽  
Fine Grained ◽  
Copper Coatings ◽  
Electrochemically Deposited ◽  
Composite Models ◽  
Average Current ◽  
Composite Hardness ◽  
Coating Hardness

The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 µm thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm−2, and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418–1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the “soft film on hard substrate” composite hardness system. The obtained stress exponents in the 4.35–7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.

scholarly journals Direct measurement of the thermoelectric properties of electrochemically deposited Bi2Te3 thin films

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Jose Recatala-Gomez ◽  
Pawan Kumar ◽  
Ady Suwardi ◽  
Anas Abutaha ◽  
Iris Nandhakumar ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermoelectric Properties ◽  
Bismuth Telluride ◽  
Indium Tin Oxide ◽  
Seed Layer ◽  
Room Temperature ◽  
Low Cost ◽  
Temperature Dependent ◽  
Temperature Heat ◽  
Electrochemically Deposited

Abstract The best known thermoelectric material for near room temperature heat-to-electricity conversion is bismuth telluride. Amongst the possible fabrication techniques, electrodeposition has attracted attention due to its simplicity and low cost. However, the measurement of the thermoelectric properties of electrodeposited films is challenging because of the conducting seed layer underneath the film. Here, we develop a method to directly measure the thermoelectric properties of electrodeposited bismuth telluride thin films, grown on indium tin oxide. Using this technique, the temperature dependent thermoelectric properties (Seebeck coefficient and electrical conductivity) of electrodeposited thin films have been measured down to 100 K. A parallel resistor model is employed to discern the signal of the film from the signal of the seed layer and the data are carefully analysed and contextualized with literature. Our analysis demonstrates that the thermoelectric properties of electrodeposited films can be accurately evaluated without inflicting any damage to the films.

Enzymatic glucose biosensor based on bismuth nanoribbons electrochemically deposited on reduced graphene oxide

2015 ◽  
Vol 182 (13-14) ◽  
pp. 2165-2172 ◽  
Author(s):  
Rajkumar Devasenathipathy ◽  
Raj Karthik ◽  
Shen-Ming Chen ◽  
Mohammad Ajmal Ali ◽  
Veerappan Mani ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Reduced Graphene Oxide ◽  
Glucose Biosensor ◽  
Reduced Graphene ◽  
Electrochemically Deposited
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