scholarly journals Carrier recombination lifetime in InAs thin films bonded on low-k flexible substrates

AIP Advances ◽  
2012 ◽  
Vol 2 (4) ◽  
pp. 042105 ◽  
Author(s):  
Toshi-kazu Suzuki ◽  
Hayato Takita ◽  
Cong Thanh Nguyen ◽  
Koichi Iiyama
Keyword(s):  
Thin Films ◽  
Flexible Substrates ◽  
Recombination Lifetime ◽  
Carrier Recombination ◽  
Inas Thin Films ◽  
Low K

Finite-Element Modeling and Quantitative Measurement Using Scanning Microwave Microscopy to Characterize Dielectric Films

2018 ◽  
Author(s):  
K. A. Rubin ◽  
W. Jolley ◽  
Y. Yang
Keyword(s):  
Thin Films ◽  
Dielectric Film ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Silicon Substrates ◽  
Fem Modeling ◽  
Dielectric Thin Films ◽  
Microwave Microscopy ◽  
Scanning Microwave Microscopy ◽  
Low K

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.

Magnetic and microwave properties of FeNi thin films of different thicknesses deposited onto cyclo olefin copolymer flexible substrates

2021 ◽  
pp. 1-1
Author(s):  
C. M. Madrid Aguilar ◽  
A. V. Svalov ◽  
A. A. Kharlamova ◽  
E. E. Shalygina ◽  
A. Larranaga ◽  
...  
Keyword(s):  
Thin Films ◽  
Microwave Properties ◽  
Flexible Substrates

Monomer methylmethacrylate (MMA) incorporated hybrid low-k thin films

2013 ◽  
Vol 9 (6) ◽  
pp. 723-728 ◽  
Author(s):  
Bhavana N. Joshi ◽  
A. M. Mahajan
Keyword(s):  
Thin Films ◽  
Low K

Studies of the Coefficient of Thermal Expansion of Low-k ILD Materials by X-Ray Reflectivity

2006 ◽  
Vol 914 ◽  
Author(s):  
George Andrew Antonelli ◽  
Tran M. Phung ◽  
Clay D. Mortensen ◽  
David Johnson ◽  
Michael D. Goodner ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Chemical Vapor ◽  
Dielectric Materials ◽  
Free Standing ◽  
Dielectric Thin Films ◽  
X Ray ◽  
Chemical Vapor Deposited ◽  
Low K

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.

Correlation of Fe-Rich Defect Centre and Minority Carrier Lifetime in p-Type Multicrystalline Silicon

2013 ◽  
Vol 440 ◽  
pp. 82-87 ◽  
Author(s):  
Mohammad Jahangir Alam ◽  
Mohammad Ziaur Rahman
Keyword(s):  
Carrier Lifetime ◽  
Minority Carrier ◽  
Minority Carrier Lifetime ◽  
Multicrystalline Silicon ◽  
Recombination Lifetime ◽  
Spatially Resolved ◽  
Carrier Recombination ◽  
Negative Role ◽  
P Type ◽  
The Impact

A comparative study has been made to analyze the impact of interstitial iron in minority carrier lifetime of multicrystalline silicon (mc-Si). It is shown that iron plays a negative role and is considered very detrimental for minority carrier recombination lifetime. The analytical results of this study are aligned with the spatially resolved imaging analysis of iron rich mc-Si.

Solution Processable Colloidal Nanoplates as Building Blocks for High-Performance Electronic Thin Films on Flexible Substrates

Nano Letters ◽  
2014 ◽  
Vol 14 (11) ◽  
pp. 6547-6553 ◽  
Author(s):  
Zhaoyang Lin ◽  
Yu Chen ◽  
Anxiang Yin ◽  
Qiyuan He ◽  
Xiaoqing Huang ◽  
...  
Keyword(s):  
Thin Films ◽  
High Performance ◽  
Building Blocks ◽  
Flexible Substrates ◽  
Solution Processable

Tensile and fatigue behaviors of printed Ag thin films on flexible substrates

2012 ◽  
Vol 101 (19) ◽  
pp. 191907 ◽  
Author(s):  
Gi-Dong Sim ◽  
Sejeong Won ◽  
Soon-Bok Lee
Keyword(s):  
Thin Films ◽  
Flexible Substrates

Morphological, electrical and optical properties of sputtered Mo thin films on flexible substrates

2009 ◽  
Vol 206 (3) ◽  
pp. 540-546 ◽  
Author(s):  
A. Bollero ◽  
M. Andrés ◽  
C. García ◽  
J. de Abajo ◽  
M. T. Gutiérrez
Keyword(s):  
Thin Films ◽  
Optical Properties ◽  
Flexible Substrates ◽  
Electrical And Optical Properties
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