A compact and miniaturized high resolution capacitance dilatometer for measuring thermal expansion and magnetostriction

2012 ◽  
Vol 83 (9) ◽  
pp. 095102 ◽  
Author(s):  
R. Küchler ◽  
T. Bauer ◽  
M. Brando ◽  
F. Steglich
2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.


2020 ◽  
Vol 47 (11) ◽  
Author(s):  
Nicole Floquet ◽  
Daniel Vielzeuf ◽  
Vasile Heresanu ◽  
Didier Laporte ◽  
Jonathan Perrin

2005 ◽  
Vol 38 (6) ◽  
pp. 1038-1039 ◽  
Author(s):  
Robert Hammond ◽  
Klimentina Pencheva ◽  
Kevin J. Roberts ◽  
Patricia Mougin ◽  
Derek Wilkinson

Variable-temperature high-resolution capillary-mode powder X-ray diffraction is used to assess changes in unit-cell dimensions as a function of temperature over the range 188–328 K. No evidence was found for any polymorphic transformations over this temperature range and thermal expansion coefficients for urea were found to be αa= (5.27 ± 0.26) × 10−5 K−1and αc= (1.14 ± 0.057) × 10−5 K−1.


1998 ◽  
Vol 12 (04) ◽  
pp. 449-470 ◽  
Author(s):  
Goutam Dev Mukherjee ◽  
C. Bansal ◽  
Ashok Chatterjee

Thermal expansion measurements have been performed on nickel and iron using a three terminal capacitance dilatometer with a new cell design and a theoretical model has been developed to obtain the electron-magnetic, lattice and magnon contributions to thermal expansion and corresponding Grüneisen parameters.


1971 ◽  
Vol 42 (1) ◽  
pp. 155-156 ◽  
Author(s):  
Donald A. Miller ◽  
J. W. Kauffman ◽  
C. R. Kannewurf ◽  
R. A. Arndt

Author(s):  
Neeraj Kumar Rajak ◽  
Neha Kondedan ◽  
Husna Jan ◽  
Muhammed Dilshah U ◽  
Navya S. D. ◽  
...  

Abstract We present high resolution thermal expansion measurement data obtained with high relative sensitivity of ΔL/L = 10-9 and accuracy of ±2% using closed cycle refrigerators employing two different dilatometers. Experimental details of the set-up utilizing the multi-function probe integrated with the cold head of two kinds of closed cycle refrigerators, namely, pulse tube and Gifford-McMahon cryocoolers, has been described in detail. The design consists of decoupling the bottom sample puck and taking connections from the top of the multi-function probe to mitigate the vibrational noise arising from the cold heads, using which smooth and high quality thermal expansion data could be obtained. It was found that dilatometer #2 performs a better noise mitigation than dilatometer #1 due to the constrained movement of the spring in dilatometer #2. This was confirmed by finite element method simulations that were performed for understanding the spring movement in each dilatometer using which the effect of different forces/pressures and vibrations on the displacement of the spring was studied. Linear thermal expansion coefficient α obtained using both dilatometers was evaluated using derivative of a polynomial fit. The resultant α obtained using dilatometer #2 and either of the closed cycle cryostats on standard metals silver and aluminium showed excellent match with published values obtained using wet cryostats. Finally, thermal expansion measurements is reported on single crystals of two high temperature superconductors YBa2Cu3-xAlxO6+δ and Bi2Sr2CaCu2O8+x along the c-axis with very good match found with published data obtained earlier using wet liquid helium based cryostats.


2018 ◽  
Vol 113 (18) ◽  
pp. 182102 ◽  
Author(s):  
Zongzhe Cheng ◽  
Michael Hanke ◽  
Zbigniew Galazka ◽  
Achim Trampert

2009 ◽  
Vol 79 (21) ◽  
Author(s):  
M. S. da Luz ◽  
J. J. Neumeier ◽  
R. K. Bollinger ◽  
A. S. Sefat ◽  
M. A. McGuire ◽  
...  

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