Metallic glass mold insert for hot embossing of polymers

2012 ◽  
Vol 112 (2) ◽  
pp. 024506 ◽  
Author(s):  
J. Ma ◽  
X. Zhang ◽  
W. H. Wang
2012 ◽  
Vol 510 ◽  
pp. 639-644 ◽  
Author(s):  
Xiang Zhang ◽  
Jiang Ma ◽  
Ran Bai ◽  
Qian Li ◽  
Bing Li Sun ◽  
...  

Polymer microstructures are used more and more in many fields. Hot embossing is one of molding processing to achieve micro polymer components. In this paper, bulk metallic glass was selected as mold material to fabricate mold insert of micro hot embossing. Traditional UV-lithography and ICP-etching were used to achieve micro features on silicon wafer. And then, micro features were transferred from silicon wafer to bulk metallic glass mold insert above its glass transition temperature. Finally, applied bulk metallic glass mold insert to replicate polymer microstructure with hot embossing. Three commonly used thermoplastic polymers: high-density polyethylene (HDPE), polypropylene (PP) and polycarbonate (PC) were selected in this study. Experiments show that microstructures can have a good replication from bulk metallic glass mold insert to the thermoplastic polymer using hot embossing.


2014 ◽  
Vol 21 (7) ◽  
pp. 1453-1457 ◽  
Author(s):  
Xiang Zhang ◽  
Jiang Ma ◽  
Ge Fang ◽  
Bingli Sun ◽  
Junfeng Li ◽  
...  

Author(s):  
Sridhar P ◽  
Supreet Singh Bahga ◽  
Jitendra P. Khatait

Abstract A microfluidic chip requires micro-channels to be created on a substrate. This paper focuses on the design and development of a precision hot embossing machine for replication of microstructures on a PMMA substrate. Kinematic coupling using three spherical balls in radial v-grooves is used to achieve precise positioning of the mold insert with the base. Flexure based parallel guidance mechanism is used for one DOF motion required for the embossing process. The mechanism allows the motion of the mold normal to the substrate surface. Flexure based kinematic coupling with the thermal center is designed to mitigate thermal stress build-up during heating and cooling of the mold insert. An Arduino-based micro-controller is developed to control the temperature profile during the process. A prototype is fabricated and experiments are performed with an aluminium mold insert on a PMMA substrate. The result shows the feasibility of the concept and the set-up can be used to develop a cost-effective precision hot embossing machine for creating micro-patterns for microfluidic applications.


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