Thermal stability of wetting layer in quantum dot self-assembly

2012 ◽  
Vol 111 (9) ◽  
pp. 093526 ◽  
Author(s):  
Y. Y. Cao ◽  
G. W. Yang
2021 ◽  
Vol 8 (1) ◽  
Author(s):  
Tae Hyeong Kim ◽  
Hyeji Kim ◽  
Hyo Jun Jang ◽  
Nara Lee ◽  
Kwang Hyun Nam ◽  
...  

AbstractIn the study reported herein, silver-coated copper (Ag/Cu) powder was modified with alkanethiols featuring alkyl chains of different lengths, namely butyl, octyl, and dodecyl, to improve its thermal stability. The modification of the Ag/Cu powders with adsorbed alkanethiols was confirmed by scanning electron microscopy with energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and thermogravimetric analysis. Each powder was combined with an epoxy resin to prepare an electrically conductive film. The results confirmed that the thermal stability of the films containing alkanethiol-modified Ag/Cu powders is superior to that of the film containing untreated Ag/Cu powder. The longer the alkyl group in the alkanethiol-modified Ag/Cu powder, the higher the initial resistance of the corresponding electrically conductive film and the lower the increase in resistance induced by heat treatment.


2020 ◽  
Vol 18 (21) ◽  
pp. 3996-3999
Author(s):  
Takuho Saito ◽  
Shiki Yagai

Inversion of the amide connectivity of an azobenzene dyad, which self-assembles into chiral toroids and nanotubes, improves the thermal stability of the assemblies, however it negatively affects supramolecular chirality.


Nanoscale ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 1022-1031 ◽  
Author(s):  
Adriano Gonnelli ◽  
Silvia Pieraccini ◽  
Enrico J. Baldassarri ◽  
Sergio Funari ◽  
Stefano Masiero ◽  
...  

Elongation, flexibility and thermal stability of metallo-responsive architectures in dodecane.


1997 ◽  
Vol 31 (1) ◽  
pp. 84-87 ◽  
Author(s):  
A. E. Zhukov ◽  
A. Yu. Egorov ◽  
A. R. Kovsh ◽  
V. M. Ustinov ◽  
M. V. Maksimov ◽  
...  

2014 ◽  
Vol 35 (9) ◽  
pp. 1051-1057
Author(s):  
陈肖慧 CHEN Xiao-hui ◽  
袁曦 YUAN Xi ◽  
华杰 HUA Jie ◽  
赵家龙 ZHAO Jia-long ◽  
李海波 LI Hai-bo

2011 ◽  
Vol 133 (37) ◽  
pp. 14488-14491 ◽  
Author(s):  
Arivazhagan Rajendran ◽  
Masayuki Endo ◽  
Yousuke Katsuda ◽  
Kumi Hidaka ◽  
Hiroshi Sugiyama

2013 ◽  
Vol 4 (21) ◽  
pp. 3677-3682 ◽  
Author(s):  
Yixuan Yu ◽  
Christian A. Bosoy ◽  
Detlef-M. Smilgies ◽  
Brian A. Korgel

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