Effect of the molecule shape on the diffusion in molecular fluids. Molecular dynamics calculation results for SF6–C6H6 and a related model solution

1988 ◽  
Vol 89 (12) ◽  
pp. 7457-7461 ◽  
Author(s):  
C. Hoheisel
2018 ◽  
Vol 4 (4) ◽  
Author(s):  
Qiang Zhao ◽  
Yang Li ◽  
Zheng Zhang ◽  
Xiaoping Ouyang

The sputtering of graphite due to the bombardment of hydrogen isotopes is crucial to successfully using graphite in the fusion environment. In this work, we use molecular dynamics to simulate the sputtering using the large-scale atomic/molecular massively parallel simulator (lammps). The calculation results show that the peak values of the sputtering yield are between 25 eV and 50 eV. When the incident energy is greater than the energy corresponding to the peak value, a lower carbon sputtering yield is obtained. The temperature that is most likely to sputter is approximately 800 K for hydrogen, deuterium, and tritium. Below the 800 K, the sputtering yields increase with temperature. By contrast, above the 800 K, the yields decrease with increasing temperature. Under the same temperature and incident energy, the sputtering rate of tritium is greater than that of deuterium, which in turn is greater than that of hydrogen. When the incident energy is 25 eV, the sputtering yield at 300 K increases below an incident angle at 30 deg and remains steady after that.


Author(s):  
Qiang Zhao ◽  
Yang Li ◽  
Zheng Zhang ◽  
Xiaoping Ouyang

The sputtering of graphite due to the bombardment of hydrogen isotopes is one of the critical issues in successfully using graphite in the fusion environment. In this work, we use molecular dynamics method to simulate the sputtering by using the LAMMPS. Calculation results show that the peak values of the sputtering yield are located between 25 eV to 50 eV. After the energy of 25 eV, the higher incident energy cause the lower carbon sputtering yield. The temperature which is most likely to sputter is about 800 K for hydrogen, deuterium and tritium. Before the 800 K, the sputtering rates increase when the temperature increase. After the 800 K, they decrease with the temperature increase. Under the same temperature and energy, the sputtering rate of tritium is bigger than that of deuterium, the sputtering rate of deuterium is bigger than that of hydrogen.


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