The Munich laser-ion-source for use of negative ions

1992 ◽  
Author(s):  
T. Henkelmann ◽  
G. Korschinek
2009 ◽  
Author(s):  
Y. Liu ◽  
J. R. Beene ◽  
T. Gottwald ◽  
C. C. Havener ◽  
C. Mattolat ◽  
...  

2005 ◽  
Vol 160 (10-12) ◽  
pp. 553-555
Author(s):  
A. Balabaev ◽  
S. Kondrashev ◽  
B. Sharkov ◽  
A. Vasiliev
Keyword(s):  

1992 ◽  
Vol 63 (4) ◽  
pp. 2841-2843 ◽  
Author(s):  
B. Yu. Sharkov ◽  
A. V. Shumshurov ◽  
V. P. Dubenkow ◽  
O. B. Shamaev ◽  
A. A. Golubev

2001 ◽  
Vol 89 (11-12) ◽  
Author(s):  
U. Köster

For the production of radioactive ion beams by means of the ISOL (isotope separation on-line) method in which the nuclei of interest are stopped in a thick target, chemistry plays a crucial role. It serves to separate the nuclear reaction products in atomic or molecular form from the bulk target and to transfer them efficiently to an ion source. This article gives an overview of ISOLDE radiochemical methods where targets (liquid metals, solid metals, carbides and oxides) and ion sources are optimized with respect to efficiency, speed and chemical selectivity. Rather pure beams of non-metals and volatile metals can be obtained with a temperature-controlled transfer line acting as thermo-chromatograph. For less volatile metals the temperature of the target and ion source units needs to be kept as high as possible, but a selective ion source can be used: positive surface ionization for metals with ionization potentials below about 6 eV and the RILIS (resonance ionization laser ion source) technique for most other metals.


1994 ◽  
Vol 354 ◽  
Author(s):  
Junzo Ishikawa

AbstractNegative-ion implantation is a promising technique for forthcoming ULSI (more than 256 M bits) fabrication and TFT (for color LCD) fabrication, since the surface charging voltage of insulated electrodes or insulators implanted by negative ions is found to saturate within so few as several volts, no breakdown of insulators would be expected without a charge neutralizer in these fabrication processes. Scatter-less negative-ion implantation into powders is also possible. For this purpose an rf-plasma-sputter type heavy negative-ion source was developed, which can deliver several milliamperes of various kinds of negative ion currents such as boron, phosphor, silicon, carbon, copper, oxygen, etc. A medium current negative-ion implanter with a small version of this type of ion source has been developed.


2002 ◽  
Vol 73 (2) ◽  
pp. 706-706
Author(s):  
S. Kondrashev ◽  
N. Mescheryakov ◽  
B. Sharkov ◽  
A. Shumshurov ◽  
A. Balabaev ◽  
...  
Keyword(s):  

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