Reduced thermal conductivity due to scattering centers in p-type SiGe alloys

1992 ◽  
Author(s):  
John S. Beaty ◽  
Johnathan L. Rolfe ◽  
Jan Vandersande ◽  
Jean-Pierre Fleurial
Keyword(s):  
Thermal Conductivity ◽  
Scattering Centers ◽  
P Type

Reduced Thermal Conductivity Due to Scattering Centers in p-Type SiGe Alloys

1992 ◽  
Author(s):  
John S. Beaty ◽  
Jonathon L. Rolfe ◽  
Jan Vandersande ◽  
Jean-Pierre Fleurial
Keyword(s):  
Thermal Conductivity ◽  
Scattering Centers ◽  
P Type

Thermoelectric Properties of Hot-Pressed Ultra-Fine Particulate Sige Powder Alloys with Inert Additions

1991 ◽  
Vol 234 ◽  
Author(s):  
John S. Beaty ◽  
Jonathan L Rolfe ◽  
Jan W. Vandersande
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
Thermoelectric Materials ◽  
Phonon Scattering ◽  
Fine Powder ◽  
Fine Particulates ◽  
High Temperature Heat Treatment ◽  
Scattering Centers ◽  
Efficiency Theory ◽  
P Type

ABSTRACTThe objective of the work reported here is to reduce the thermal conductivity of thermoelectric materials in order to improve their figureof- merit and conversion efficiency. Theory predicts that the addition of ultra-fine, inert, phonon-scattering centers to thermoelectric materials will reduce their thermal conductivity [1]. To investigate this prediction, ultra-fine particulates (20Å to 120Å) of silicon nitride have been added to boron doped, p-type, 80/20 SiGe. All of the SiGe samples produced from ultra-fine powder have lower thermal conductivities, than that for standard SiGe, but high temperature heat treatment increases the thermal conductivity back to the value for standard SiGe. However, the SiGe samples with silicon nitride, inert, phonon-scattering centers, retained the lower thermal conductivity after several heat treatments. A reduction of approximately 25% in thermal conductivity has been achieved in these samples.

Phase Transformation and Thermoelectric Properties of Sn-Filled/Fe-Doped CoSb3 Skutterudites

2011 ◽  
Vol 312-315 ◽  
pp. 223-228
Author(s):  
Il Ho Kim
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Seebeck Coefficient ◽  
Phonon Scattering ◽  
Induction Melting ◽  
X Ray Diffraction ◽  
Scattering Centers ◽  
Δ Phase ◽  
Increasing Temperature ◽  
P Type

Sn-filled and Fe-doped CoSb3 skutterudites were synthesized by encapsulated induction melting. A single δ-phase was obtained by subsequent annealing, as confirmed by X-ray diffraction. The as-solidified ingot consisted of mixed phases of -CoSb, -CoSb2, δ-CoSb3 and elemental Sb. The phases could be transformed by annealing, and the phases of the as-solidified ingot annealed at 773 K for 24 h transformed to δ-CoSb3. The temperature dependence of the Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed p-type conduction. The electrical resistivity increased with increasing temperature, which showed that the SnzCo3FeSb12 skutterudite is highly degenerate. The thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. The thermoelectric figure of merit was enhanced by Sn filling and its optimum composition was considered to be Sn0.3Co3FeSb12.

Sticky thermoelectric materials for flexible thermoelectric modules to capture low-temperature waste heat

MRS Advances ◽  
2020 ◽  
Vol 5 (10) ◽  
pp. 481-487 ◽  
Author(s):  
Norifusa Satoh ◽  
Masaji Otsuka ◽  
Yasuaki Sakurai ◽  
Takeshi Asami ◽  
Yoshitsugu Goto ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Low Temperature ◽  
Waste Heat ◽  
Air Cooling ◽  
Conductive Adhesives ◽  
Hot Plate ◽  
Low Thermal Conductivity ◽  
Te Modules ◽  
P Type ◽  
Flexible Thermoelectric

ABSTRACTWe examined a working hypothesis of sticky thermoelectric (TE) materials, which is inversely designed to mass-produce flexible TE sheets with lamination or roll-to-roll processes without electric conductive adhesives. Herein, we prepared p-type and n-type sticky TE materials via mixing antimony and bismuth powders with low-volatilizable organic solvents to achieve a low thermal conductivity. Since the sticky TE materials are additionally injected into punched polymer sheets to contact with the upper and bottom electrodes in the fabrication process, the sticky TE modules of ca. 2.4 mm in thickness maintained temperature differences of ca. 10°C and 40°C on a hot plate of 40 °C and 120°C under a natural-air cooling condition with a fin. In the single-cell resistance analysis, we found that 75∼150-µm bismuth powder shows lower resistance than the smaller-sized one due to the fewer number of particle-particle interfaces in the electric pass between the upper and bottom electrodes. After adjusting the printed wiring pattern for the upper and bottom electrodes, we achieved 42 mV on a hot plate (120°C) with the 6 x 6 module having 212 Ω in the total resistance. In addition to the possibility of mass production at a reasonable cost, the sticky TE materials provide a low thermal conductivity for flexible TE modules to capture low-temperature waste heat under natural-air cooling conditions with fins for the purpose of energy harvesting.

scholarly journals Study of anisotropic thermal conductivity in textured thermoelectric alloys by Raman spectroscopy

RSC Advances ◽  
2021 ◽  
Vol 11 (39) ◽  
pp. 24456-24465
Author(s):  
Rapaka S. C. Bose ◽  
K. Ramesh
Keyword(s):  
Crystal Structure ◽  
Thermal Conductivity ◽  
Raman Spectroscopy ◽  
Transport Properties ◽  
Thermal Transport ◽  
Layered Crystal ◽  
Layered Crystal Structure ◽  
Thermal Transport Properties ◽  
Anisotropic Thermal Conductivity ◽  
P Type

Polycrystalline p-type Sb1.5Bi0.5Te3 (SBT) and n-type Bi2Te2.7Se0.3 (BTS) compounds possessing layered crystal structure show anisotropic electronic and thermal transport properties.

scholarly journals Significantly enhanced thermoelectric performance of Cu-doped p-type Bi0.5Sb1.5Te3 by a hydrothermal synthesis method

RSC Advances ◽  
2017 ◽  
Vol 7 (65) ◽  
pp. 41111-41116 ◽  
Author(s):  
Zichen Wei ◽  
Chenyang Wang ◽  
Li You ◽  
Shijie Zhao ◽  
Kang Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Hydrothermal Synthesis ◽  
Hydrothermal Method ◽  
Synthesis Method ◽  
Thermoelectric Performance ◽  
P Type

Increased electrical conductivity and decreased thermal conductivity were achieved simultaneously in the Cu-doped Bi0.5Sb1.5Te3 synthesized by a hydrothermal method.

scholarly journals Термоэлектрические свойства нанокомпозитного Bi-=SUB=-0.45-=/SUB=-Sb-=SUB=-1.55-=/SUB=-Te-=SUB=-2.985-=/SUB=- с микрочастицами SiO-=SUB=-2-=/SUB=-

2019 ◽  
Vol 53 (6) ◽  
pp. 751
Author(s):  
А.А. Шабалдин ◽  
П.П. Константинов ◽  
Д.А. Курдюков ◽  
Л.Н. Лукьянова ◽  
А.Ю. Самунин ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solution ◽  
Electrical Conductivity ◽  
Wide Temperature Range ◽  
Figure Of Merit ◽  
Nanostructured Material ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Efficiency ◽  
Thermoelectric Figure ◽  
P Type

AbstractNanocomposite thermoelectrics based on Bi_0.45Sb_1.55Te_2.985 solid solution of p -type conductivity are fabricated by the hot pressing of nanopowders of this solid solution with the addition of SiO_2 microparticles. Investigations of the thermoelectric properties show that the thermoelectric power of the nanocomposites increases in a wide temperature range of 80–420 K, while the thermal conductivity considerably decreases at 80–320 K, which, despite a decrease in the electrical conductivity, leads to an increase in the thermoelectric efficiency in the nanostructured material without the SiO_2 addition by almost 50% (at 300 K). When adding SiO_2, the efficiency decreases. The initial thermoelectric fabricated without nanostructuring, in which the maximal thermoelectric figure of merit ZT = 1 at 390 K, is most efficient at temperatures above 350 K.

Improvement on Thermoelectric Characteristics of Layered Nanostructure by Ion Beam Bombardment

2006 ◽  
Vol 929 ◽  
Author(s):  
Bangke Zheng ◽  
S. Budak ◽  
C. Muntele ◽  
Z. Xiao ◽  
S. Celaschi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Seebeck Coefficient ◽  
Electric Conductivity ◽  
Ion Beam ◽  
Thermo Electric ◽  
Super Lattice ◽  
Before And After ◽  
The Cross ◽  
Nano Cluster ◽  
P Type

ABSTRACTWe made p-type nanoscale super lattice thermoelectric cooling devices which consist of multiple periodic layers of Si1−x Gex / Si, The thickness of each layer ranges between 10 and 50 nm. The super lattice was bombarded by 5 MeV Si ion with different fluencies aiming to form nano-cluster quantum dot structures. We estimated the thermo-electric efficiency of the so fabricated devices, measuring the thin film cross plane thermal conductivity by the 3rd harmonic method, measuring the cross plane Seebeck coefficient, and finally measuring the cross plane electric conductivity before and after ion bombardment. As predicted, the thermo-electric Figure of Merit of the films increases with increasing Si ion fluencies. In addition to the effect of quantum well confinement of the phonon transmission, the nano-scale crystal quantum dots produced by the incident Si beam further adversely affects the thermal conductivity by absorbing and dissipating phonon along the lattice, and therefore further reduces the cross plane thermal conductivity, This process increases the electron density of state therefore increasing Seebeck coefficient, and the electric conductivity.

Enhanced Thermoelectric Properties of Cu3SbSe4 Compounds by Isovalent Bismuth Doping

2021 ◽  
Author(s):  
Lijun Zhao ◽  
Mingyuan Wang ◽  
Jian Yang ◽  
Jiabin Hu ◽  
Yuan Zhu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Properties ◽  
Tem Analysis ◽  
Amorphous Phases ◽  
Element Doping ◽  
Bi Doping ◽  
Earth Abundant ◽  
Te Material ◽  
P Type ◽  
Constituent Elements

Abstract Cu3SbSe4, featuring its earth-abundant, cheap, nontoxic and environmentally-friendly constituent elements, can be considered as a promising intermediate temperature thermoelectric (TE) material. Herein, a series of p-type Bi-doped Cu3Sb1 − xBixSe4 (x = 0-0.04) samples were fabricated through melting and hot pressing (HP) process, and the effects of isovalent Bi-doping on their TE properties were comparatively investigated by experimental and computational methods. TEM analysis indicates that Bi-doped samples consist of Cu3SbSe4 and Cu2 − xSe impurity phases, which is in good agreement with the results of XRD, SEM and XPS. For Bi-doped samples, the reduced electrical resistivity (ρ) caused by the optimized carrier concentrations and enhanced Seebeck coefficient derived from the densities of states near the Fermi level give rise to a high power factor of ~ 1000 µWcm− 1K− 2 at 673 K for the Cu3Sb0.985Bi0.015Se4 sample. Additionally, the multiscale defects of Cu3SbSe4-based materials involving point defects, nanoprecipitates, amorphous phases and grain boundaries can strongly scatter phonons to depress lattice thermal conductivity (κlat), resulting in a low κlat of ~ 0.53 Wm− 1K− 1 and thermal conductivity (κtot) of ~ 0.62 Wm− 1K− 1 at 673 K for the Cu3Sb0.98Bi0.02Se4 sample. As a consequence, a maximum ZT value ~ 0.95 at 673 K is obtained for the Cu3Sb0.985Bi0.015Se4 sample, which is ~ 1.9 times more than that of pristine Cu3SbSe4. This work shows that isovalent heavy-element doping is an effective strategy to optimize thermoelectric properties of copper-based chalcogenides.

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