Highly ionized physical vapor deposition plasma source working at very low pressure

2012 ◽  
Vol 100 (14) ◽  
pp. 141604 ◽  
Author(s):  
V. Stranak ◽  
A.-P. Herrendorf ◽  
S. Drache ◽  
M. Cada ◽  
Z. Hubicka ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Plasma Source ◽  
Low Pressure ◽  
Ionized Physical Vapor Deposition

Helicon plasma source for ionized physical vapor deposition

1999 ◽  
Vol 120-121 ◽  
pp. 401-404 ◽  
Author(s):  
D.B. Hayden ◽  
D.R. Juliano ◽  
M.N. Neumann ◽  
M.C. Allain ◽  
D.N. Ruzic
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Plasma Source ◽  
Helicon Plasma ◽  
Ionized Physical Vapor Deposition

Cu seed step coverage evolution with target lifetime for long-throw self ionized physical vapor deposition chambers

2022 ◽  
pp. 111717
Author(s):  
Elisa Pegoraro ◽  
Alberto Perrotta ◽  
Gianpaolo Lorito ◽  
Laura Bertarelli ◽  
Benoit-Noel Bozon ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Step Coverage ◽  
Ionized Physical Vapor Deposition

Extendibility of Cu Damascene to 0.1 μm Wide Interconnections

1998 ◽  
Vol 514 ◽  
Author(s):  
C-K. Hu ◽  
K. Y. Lee ◽  
L. Gignac ◽  
S. M. Rossnagel ◽  
C. Uzoh ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Vapor Deposition ◽  
Chemical Mechanical Polishing ◽  
Seed Layer ◽  
Physical Vapor Deposition ◽  
Ion Etching ◽  
Damascene Process ◽  
Effective Resistivity ◽  
Ionized Physical Vapor Deposition ◽  
Deposition Techniques

ABSTRACTWe demonstrate the extendibility of the Cu damascene process to 0.1 μm wide lines. Cu interconnects, 0.1 - 1 μm wide, were fabricated by a damascene process that produced planarized lines and vias, imbedded in insulators. This process was defined by 1) trench and via formation in blanket dielectrics using e-beam lithography and reactive ion etching, 2) trench fill using a series of metal depositions, and 3) chemical mechanical polishing to remove the field metals. Physical vapor and ionized physical vapor deposition techniques were used to deposit the adhesion/diffusion barrier liner and the Cu seed layer, respectively. The main Cu conductor was deposited by an electroplating method. The width of lines and vias were varied from 0.1 μm to 1 μm while the thicknesses were held constant at 0.45 μm. A near bamboo-like structure was observed in the sub-μm wide lines. The effective resistivity of the Cu lines was found to be about 2.3 μΩ-cm and was independent of width after annealing at 400 °C.

Vapor Phase Deposition Using a Plasma Spray Process

2010 ◽  
Author(s):  
Konstantin von Niessen ◽  
Malko Gindrat
Keyword(s):  
Plasma Spraying ◽  
Thermal Spray ◽  
Vapor Phase ◽  
Plasma Spray ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Low Pressure ◽  
Spray Process ◽  
Pressure Plasma ◽  
Low Pressure Plasma

Plasma spray - physical vapor deposition (PS-PVD) is a low pressure plasma spray technology recently developed by Sulzer Metco AG (Switzerland) to deposit coatings out of the vapor phase. PS-PVD is developed on the basis of the well established low pressure plasma spraying (LPPS) technology. In comparison to conventional vacuum plasma spraying (VPS) and low pressure plasma spraying (LPPS), these new process use a high energy plasma gun operated at a work pressure below 2 mbar. This leads to unconventional plasma jet characteristics which can be used to obtain specific and unique coatings. An important new feature of PS-PVD is the possibility to deposit a coating not only by melting the feed stock material which builds up a layer from liquid splats but also by vaporizing the injected material. Therefore, the PS-PVD process fills the gap between the conventional physical vapor deposition (PVD) technologies and standard thermal spray processes. The possibility to vaporize feedstock material and to produce layers out of the vapor phase results in new and unique coating microstructures. The properties of such coatings are superior to those of thermal spray and electron beam - physical vapor deposition (EB-PVD) coatings. In contrast to EB-PVD, PS-PVD incorporates the vaporized coating material into a supersonic plasma plume. Due to the forced gas stream of the plasma jet, complex shaped parts like multi-airfoil turbine vanes can be coated with columnar thermal barrier coatings using PS-PVD. Even shadowed areas and areas which are not in the line of sight to the coating source can be coated homogeneously. This paper reports on the progress made by Sulzer Metco to develop a thermal spray process to produce coatings out of the vapor phase. Columnar thermal barrier coatings made of Yttria stabilized Zircona (YSZ) are optimized to serve in a turbine engine. This includes coating properties like strain tolerance and erosion resistance but also the coverage of multiple air foils.

Characterizations of CNx thin films made by ionized physical vapor deposition

2005 ◽  
Vol 482 (1-2) ◽  
pp. 192-196 ◽  
Author(s):  
F. Tétard ◽  
P. Djemia ◽  
M.P. Besland ◽  
P.Y. Tessier ◽  
B. Angleraud
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Ionized Physical Vapor Deposition
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