Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance
2016 ◽
Vol 858
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pp. 147-150
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2019 ◽
Vol 52
(2)
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pp. 415-427
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2008 ◽
Vol 59
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pp. 86-91
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2006 ◽
Vol 54
(15)
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pp. 3863-3870
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