Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint
2000 ◽
Vol 35
(8)
◽
pp. 1253
◽
Keyword(s):
2003 ◽
Vol 58
(6)
◽
pp. 1171-1175
◽
Keyword(s):
1999 ◽
Vol 34
(9)
◽
pp. 1254-1258
◽
1983 ◽
Vol 1
(3)
◽
pp. 79-83
◽