Effect of surface preparation and interfacial layer on the quality of SiO2/GaN interfaces

2011 ◽  
Vol 109 (8) ◽  
pp. 084511 ◽  
Author(s):  
E. Al Alam ◽  
I. Cortés ◽  
M.-P. Besland ◽  
A. Goullet ◽  
L. Lajaunie ◽  
...  
Keyword(s):  
Interfacial Layer ◽  
Surface Preparation ◽  
Effect Of Surface

Effect of surface preparation on the quality of components after low-temperature carbonitriding

1984 ◽  
Vol 26 (5) ◽  
pp. 354-356
Author(s):  
V. B. Fridman ◽  
T. V. Egorshina ◽  
T. I. Kirpicheva ◽  
E. E. Chesalova
Keyword(s):  
Low Temperature ◽  
Surface Preparation ◽  
Effect Of Surface

Effect of surface preparation of ABM-1 alloy on properties of glued joints

2009 ◽  
Vol 2 (2) ◽  
pp. 124-126
Author(s):  
L. I. Anikhovskaya ◽  
V. S. Kas’kov ◽  
E. A. Kuznetsova ◽  
L. P. Kozlova
Keyword(s):  
Surface Preparation ◽  
Glued Joints ◽  
Effect Of Surface

Durability of Enamel Bonding Using Two-step Self-etch Systems on Ground and Unground Enamel

10.2341/07-42 ◽  
2008 ◽  
Vol 33 (1) ◽  
pp. 79-88 ◽  
Author(s):  
A. D. Loguercio ◽  
S. K. Moura ◽  
A. Pellizzaro ◽  
K. Dal-Bianco ◽  
R. T. Patzlaff ◽  
...  
Keyword(s):  
Bond Strength ◽  
Clinical Relevance ◽  
Water Storage ◽  
Surface Preparation ◽  
The Self ◽  
Self Etch ◽  
Effect Of Surface

Clinical Relevance The effect of surface preparation was adhesive-dependent. Improvements in resin-enamel bond strength after enamel preparation were observed only for AdheSE and Optibond Solo plus Self-Etch Primer. Among the self-etch systems, mild, self-etch Clearfil SE Bond showed the highest bond strength values. No degradation of resin-enamel bonds was observed after 12 months of water storage, regardless of the adhesive tested.

Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond

2016 ◽  
Vol 857 ◽  
pp. 79-82
Author(s):  
Roslina Ismail ◽  
Fuaida Harun ◽  
Azman Jalar ◽  
Shahrum Abdullah
Keyword(s):  
Optical Microscope ◽  
Bonding Process ◽  
Mechanical Interlocking ◽  
Average Roughness ◽  
Force Microscopy ◽  
Atomic Force ◽  
Surface Morphologies ◽  
Scanning Electron ◽  
Effect Of Surface

This work is a contribution towards the understanding of wire bond integrity and reliability in relation to their microstructural and mechanical properties in semiconductor packaging.The effect of surface roughness and hardness of leadframe on the bondability of Au wedge bond still requires detail analysis. Two type of leadframes namely leadframe A and leadframe B were chosen and scanning electron microscope (SEM) and optical microscope were used to inspect the surface morphology of leadframes and the quality of created Au wedge bond after wire bonding process. It was found that there were significant differences in the surface morphologies between these two leadframes. The atomic force microscopy (AFM) which was utilized to measure the average roughness, Ra of lead finger confirms that leadframe A has the highest Ra with value of 166.46 nm compared to that of leadframe B with value of 85.89 nm. While hardness value of different lead finger from the selected leadframe A and B obtained using Vicker microhardness tester are 180.9 VH and 154.2VH respectively.

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