Gaseous Slip Flow in Three-Dimensional Uniform Rectangular Microchannel

2011 ◽  
Author(s):  
Khaleel Khasawneh ◽  
Hongli Liu ◽  
Chunpei Cai
Keyword(s):  
Slip Flow ◽  
Three Dimensional ◽  
Rectangular Microchannel ◽  
Gaseous Slip Flow

Buoyancy effects on gaseous slip flow in a vertical rectangular microchannel

2013 ◽  
Vol 16 (1-2) ◽  
pp. 207-224 ◽  
Author(s):  
Morteza Sadeghi ◽  
Arman Sadeghi ◽  
Mohammad Hassan Saidi
Keyword(s):  
Slip Flow ◽  
Rectangular Microchannel ◽  
Gaseous Slip Flow

THREE-DIMENSIONAL STAGNATION-POINT FLOW OVER A PERMEABLE STRETCHING/SHRINKING SHEET WITH A SECOND ORDER SLIP FLOW

2021 ◽  
Vol 10 (9) ◽  
pp. 3273-3282
Author(s):  
M.E.H. Hafidzuddin ◽  
R. Nazar ◽  
N.M. Arifin ◽  
I. Pop
Keyword(s):  
Differential Equations ◽  
Stagnation Point ◽  
Flow Model ◽  
Nonlinear Partial Differential Equations ◽  
Slip Flow ◽  
Three Dimensional ◽  
Flow Characteristics ◽  
Second Order ◽  
Stagnation Point Flow ◽  
Shrinking Sheet

The problem of steady laminar three-dimensional stagnation-point flow on a permeable stretching/shrinking sheet with second order slip flow model is studied numerically. Similarity transformation has been used to reduce the governing system of nonlinear partial differential equations into the system of ordinary (similarity) differential equations. The transformed equations are then solved numerically using the \texttt{bvp4c} function in MATLAB. Multiple solutions are found for a certain range of the governing parameters. The effects of the governing parameters on the skin friction coefficients and the velocity profiles are presented and discussed. It is found that the second order slip flow model is necessary to predict the flow characteristics accurately.

Numerical Simulation Of A Microchannel For Microelectronic Cooling

2012 ◽  
Author(s):  
Wai Hing Wong ◽  
Normah Mohd. Ghazali
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Flux ◽  
Aspect Ratio ◽  
Three Dimensional ◽  
Large Temperature ◽  
Rectangular Microchannel ◽  
Numerical Work ◽  
Solid Region ◽  
Wall Interaction

Kertas kerja ini membincangkan simulasi berangka ke atas sinki haba saluran mikro dalam penyejukan alatan mikroelektronik. Model Dinamik Bendalir Berkomputer (CFD) tiga dimensi dibina menggunakan pakej komersil, FLUENT, untuk mengkaji fenomenon aliran bendalir dan pemindahan haba konjugat di dalam suatu sinki haba segi empat yang diperbuat daripada silikon. Model ditentusahkan dengan keputusan daripada uji kaji dan pengkajian berangka yang lepas untuk lingkungan nombor Reynolds kurang daripada 400 berdasarkan diameter hidraulik 86 mm. Kajian ini mengambil kira kesan kelikatan bendalir yang bersandaran dengan suhu dan keadaan aliran pra–membangun dari segi hidrodinamik dan haba. Model memberi maklumat tentang taburan suhu dan fluks haba yang terperinci di dalam sinki haba saluran mikro. Kecerunan suhu yang tinggi dicatat pada kawasan pepejal berdekatan dengan sumber. Fluks haba paling tinggi didapati pada dinding tepi saluran mikro diikuti oleh dinding atas dan bawah. Purata pekali pemindahan haba yang lebih tinggi bagi silikon menjadikan ia bahan binaan sinki haba saluran mikro yang lebih baik berbanding dengan kuprum dan aluminium. Peningkatan nisbah aspek saluran mikro yang bersegi empat memberi kecekapan penyejukan yang lebih tinggi kerana kelebaran saluran yang berkurangan memberi kecerunan halaju yang lebih tinggi dalam saluran. Nisbah aspek yang optimum yang diperoleh adalah dalam lingkungan 3.7 – 4.1. Kata kunci: Saluran mikro, CFD, FLUENT, simulasi berangka, penyejukan mikroelektron The paper discusses the numerical simulation of a micro–channel heat sink in microelectronics cooling. A three–dimensional Computational Fluid Dynamics (CFD) model was built using the commercial package, FLUENT, to investigate the conjugate fluid flow and heat transfer phenomena in a silicon–based rectangular microchannel heatsink. The model was validated with past experimental and numerical work for Reynolds numbers less than 400 based on a hydraulic diameter of 86 mm. The investigation was conducted with consideration of temperaturedependent viscosity and developing flow, both hydrodynamically and thermally. The model provided detailed temperature and heat flux distributions in the microchannel heatsink. The results indicate a large temperature gradient in the solid region near the heat source. The highest heat flux is found at the side walls of the microchannel, followed by top wall and bottom wall due to the wall interaction effects. Silicon is proven to be a better microchannel heatsink material compared to copper and aluminum, indicated by a higher average heat transfer. A higher aspect ratio in a rectangular microchannel gives higher cooling capability due to high velocity gradient around the channel when channel width decreases. Optimum aspect ratio obtained is in the range of 3.7 – 4.1. Key words: Microchannel, CFD, FLUENT, numerical simulation, microeletronics cooling

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