Carbon incorporation during growth of GaAs by TEGa‐AsH3 base low‐pressure metalorganic chemical vapor deposition

1993 ◽  
Vol 73 (11) ◽  
pp. 7851-7856 ◽  
Author(s):  
H. D. Chen ◽  
C. Y. Chang ◽  
K. C. Lin ◽  
S. H. Chan ◽  
M. S. Feng ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Metalorganic Chemical Vapor Deposition ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Carbon Incorporation ◽  
Metalorganic Chemical

Investigation of Carbon Incorporation into GaAs by TEGa-AsH3 Based Low Pressure Metalorganic Chemical Vapor Deposition

1993 ◽  
Vol 300 ◽  
Author(s):  
M. S. Feng ◽  
H. D. Chen ◽  
C. H. Wu
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Metalorganic Chemical Vapor Deposition ◽  
Dopant Concentration ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Carbon Incorporation ◽  
Carbon Doped ◽  
Gaas Films ◽  
Metalorganic Chemical

ABSTRACTHeavily Carbon doped GaAs(l×1018−1×1020cm−3 ) grown by low pressure metalorganic chemical vapor deposition(LPMOCVD) using triethylgallium(TEGa), arsine(AsH3) as sources and liquid carbon-tetrachoride(CCI4) as dopant has been investigated. The carrier concentration was verified at various growth temperatures, V/III ratios and CCI4 flow rates. Dopant concentration first increased from 550°C and reached a maxium at 570°C and then decreased monotonously. Carbon incorporation was strongly enhanced when V/III ratio was less than 30 at Tg=590°C or less than 40 at Tg=630°C. Hole concentration increased and then decreased as CCI4 increased. The doping efficiency of epitaxtial layers grown on(100) substrate was higher than that on 2° off toward <110> misoriented substrate. Carbon doped GaAs films had higher Hall mobility than zinc doped GaAs films at high doping level due to less self-compensation. The highest dopant concentration in this system was 2.3×1020cm−3 at Tg=580°C and V/III=10.

GaInN/GaN Multi-Quantum Well Laser Diodes Grown by Low-Pressure Metalorganic Chemical Vapor Deposition

1998 ◽  
Vol 3 ◽  
Author(s):  
P. Kung ◽  
A. Saxler ◽  
D. Walker ◽  
A. Rybaltowski ◽  
Xiaolong Zhang ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Quantum Well ◽  
Vapor Deposition ◽  
Metalorganic Chemical Vapor Deposition ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Threshold Current ◽  
Threshold Current Density ◽  
Multi Quantum Well ◽  
Metalorganic Chemical

We report the growth, fabrication and characterization of GaInN/GaN multi-quantum well lasers grown on (00·1) sapphire substrates by low pressure metalorganic chemical vapor deposition. The threshold current density of a 1800 μm long cavity length laser was 1.4 kA/cm2 with a threshold voltage of 25 V. These lasers exhibited series resistances of 13 and 14 Ω at 300 and 79 K, respectively.

Fabrication/Characterization of a Pseudomorphic Ga0.1In0.9P/InP MESFET

1993 ◽  
Vol 300 ◽  
Author(s):  
M. S. Feng ◽  
Y. M. Hsin ◽  
C. H. Wu
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Metalorganic Chemical Vapor Deposition ◽  
Energy Gap ◽  
Chemical Vapor ◽  
Drain Current ◽  
Low Pressure ◽  
Inp Substrate ◽  
Metalorganic Chemical

ABSTRACTA pseudomorphic Ga0.1In0.9P/InP MESFET grown by low pressure metalorganic chemical vapor deposition(LP-MOCVD) has been fabricated and characterized. The results indicated a transconductance of 66.7 ms/mm and a saturation drain current (Idss) of 55.6 mA have been achieved; furthermore, the Schottky barrier on InGaP as high as 0.67eV can be obtained using Pt2Si as the gate material. For comparison, a conventional InP MESFET with 5μm gate length has also been fabricated on InP epitaxial layer grown by low pressure metalorganic chemical vapor deposition on Fe-doped semi-insulating InP substrate. The transconductance and Idss were found to be 46.7 mS/mm and 43.1 mA at zero gate, respectively, for the depletion mode n-channel MESFET with Au as the gate metal; whereas, for the MESFET using Pt2Si as the gate metal, a transconductance of 40.3 mS/mm and a saturation drain current of 41.1 mA at zero gate bias have been obtained. The results indicated that Ga0.1In0.9P/lnP MESFET has better performance than InP MESFET because of higher energy gap of Ga0.1In0.9P.

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