Anomalous deposition rate dependence of hydrogenated amorphous silicon on substrate temperature

1987 ◽  
Vol 62 (7) ◽  
pp. 3060-3061 ◽  
Author(s):  
Shin‐ichiro Ishihara ◽  
Masatoshi Kitagawa ◽  
Takashi Hirao
1992 ◽  
Vol 258 ◽  
Author(s):  
Gautam Ganguly ◽  
Akihisa Matsuda

ABSTRACTThe idea of surface mobility of growth precursors determined material quality has been exploited by raising the substrate temperature above the conventional 250°C and the ensuing thermal depletion of the surface hydrogen coverage compensated by increasing the precursor flux (deposition rate) to prepare ultra low defect density hydrogenated amorphous silicon.


1995 ◽  
Vol 78 (1) ◽  
pp. 317-320 ◽  
Author(s):  
J. P. Kleider ◽  
C. Longeaud ◽  
M. Barranco‐Diaz ◽  
P. Morin ◽  
P. Roca i Cabarrocas

1989 ◽  
Vol 149 ◽  
Author(s):  
Takaaki Kamimura ◽  
Hidetoshi Nozaki ◽  
Naoshi Sakuma ◽  
Mitsuo Nakajima ◽  
Hiroshi Ito

ABSTRACTHydrogenated amorphous silicon (a-Si:H) films were prepared by mercury photosensitized decomposition of silane using a low-pressure mercury lamp. The deposition rate showed an activation type for substrate temperature (the activation energy: 0.13 eV), because the deposition rate would be determined by the rate of hydrogen elimination from the hydrogen saturated surface. Moreover, the relationship was found between the Si-H2 bond density in a- Si:H films and the gas phase reactions.


1996 ◽  
Vol 420 ◽  
Author(s):  
W. Futako ◽  
I. Shimizu ◽  
C. M. Fortmann

AbstractHydrogenated amorphous silicon (a-Si:H) with a gaps narrower than 1.7 eV were made by repeating the deposition of a thin layer (1–3 nm thick) and the treatment of growing surface with a mixture of H and Ar*. Crystallization induced by permeation of hydrogen into the subsurface at high substrate temperature (>200C) was efficiently prevented by treating with a mixture of H and Ar*. The activation of growing surface may arise from releasing a part of hydrogen on surface by treating with Ar*. High quality a-Si:H films containing hydrogen of 3 atom % with a gap of 1.6 eV were made by chemical annealing with a mixture of H and Ar*.


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