Minority‐carrier injection into relaxation semiconductors

1986 ◽  
Vol 60 (8) ◽  
pp. 2904-2909 ◽  
Author(s):  
Y. Moreau ◽  
J.‐C. Manifacier ◽  
H. K. Henisch
1975 ◽  
Vol 11 (4) ◽  
pp. 1563-1568 ◽  
Author(s):  
C. Popescu ◽  
H. K. Henisch

2010 ◽  
Vol 207 (6) ◽  
pp. 1509-1513 ◽  
Author(s):  
K. Sarpatwari ◽  
S. E. Mohney ◽  
S. Ashok ◽  
O. O. Awadelkarim

2020 ◽  
Vol 1004 ◽  
pp. 801-807
Author(s):  
Takaaki Tominaga ◽  
Shiro Hino ◽  
Yohei Mitsui ◽  
Junichi Nakashima ◽  
Koutarou Kawahara ◽  
...  

A total loss reduction of 3.3 kV power module by using SiC-MOSFET embedding SBD has been demonstrated through the investigation of DC characteristics and switching characteristics. Despite 1.1 times larger on-resistance than that of conventional SiC-MOSFET due to larger cell pitch, superior switching characteristics of SiC-MOSFET embedding SBD, which are due to smaller total chip area than that of SiC-MOSFET coupled with external SBD and due to elimination of recovery charge by minority carrier injection compared with SiC-MOSFET utilizing its body diode, enable the total loss reduction especially for high frequency operation.


2003 ◽  
Vol 75 (3-4) ◽  
pp. 405-409
Author(s):  
Yoshio Ohshita ◽  
Tuong Khanh Vu ◽  
Masafumi Yamaguchi

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