Very low surface recombination velocity on p-type c-Si by high-rate plasma-deposited aluminum oxide

2009 ◽  
Vol 95 (15) ◽  
pp. 151502 ◽  
Author(s):  
Pierre Saint-Cast ◽  
Daniel Kania ◽  
Marc Hofmann ◽  
Jan Benick ◽  
Jochen Rentsch ◽  
...  
1970 ◽  
Vol 17 (2) ◽  
pp. 119-124 ◽  
Author(s):  
Karolis GULBINAS ◽  
Vytautas GRIVICKAS ◽  
Haniyeh P. MAHABADI ◽  
Muhammad USMAN ◽  
Anders HALLÉN

n- and p-type 4H-SiC epilayers were grown on heavily doped SiC substrates. The thickness of the p-type layer was 7 µm and the doping level around 1017 cm 3, while the n-type epilayers were 15 µm thick and had a doping concentration of 3 - 5*1015 cm 3. Several different surface treatments were then applied on the epilayers for surface passivation: SiO2 growth, Al2O3 deposited by atomic layer deposition, and Ar-ion implantation. Using collinear pump - probe technique the effective carrier lifetimes were measured from various places and statistical lifetime distributions were obtained. For surface recombination evaluation, two models are presented. One states that surface recombination velocity (SRV) is equal on both the passivation/epi layer interface (S2) and the deeper interface between the epilayer and the SiC substrate i. e. (S1 = S2). The other model is simulated assuming that SRV in the epilayer/substrate (S1) interface is constant while in the passivation layer/epilayer (S2) interface SRV can be varied S2 < S1. Empirical nomograms are presented with various parameters sets to evaluate S2 values. We found that on the investigated 4H-SiC surfaces S2 ranges from 3x104 to 5x104 assuming that the bulk lifetime is 4 (µs. In Ar+ implanted surfaces S2 is between (105 - 106) cm/s.http://dx.doi.org/10.5755/j01.ms.17.2.479


2007 ◽  
Vol 989 ◽  
Author(s):  
Qi Wang ◽  
Matt R. Page ◽  
Eugene Iwancizko ◽  
Yueqin Xu ◽  
Lorenzo Roybal ◽  
...  

AbstractHigh open-circuit voltage (Voc) silicon heterojunction (SHJ) solar cells are fabricated in double-heterojunction a-Si:H/c-Si/a-Si:H structures using low temperature (<225°C) hydrogenated amorphous silicon (a-Si:H) contacts deposited by hot-wire chemical vapor deposition (HWCVD). On p-type c-Si float-zone wafers, we used an amorphous n/i contact to the top surface and an i/p contact to the back surface to obtain a Voc of 667 mV in a 1 cm2 cell with an efficiency of 18.2%. This is the best reported p-type SHJ voltage. In our labs, it improves over the 652 mV cell obtained with a front amorphous n/i heterojunction emitter and a high-temperature alloyed Al back-surface-field contact. On n-type c-Si float-zone wafers, we used an a Si:H (p/i) front emitter and an a-Si:H (i/n) back contact to achieve a Voc of 691 mV on 1 cm2 cell. Though not as high as the 730 mV reported by Sanyo on n-wafers, this is the highest reported Voc for SHJ c-Si cells processed by the HWCVD technique. We found that effective c-Si surface cleaning and a double-heterojunction are keys to obtaining high Voc. Transmission electron microscopy reveals that high Voc cells require an abrupt interface from c-Si to a-Si:H. If the transition from the base wafer to the a-Si:H incorporates either microcrystalline or epitaxial Si at c Si interface, a low Voc will result. Lifetime measurement shows that the back-surface-recombination velocity (BSRV) can be reduced to ~15 cm/s through a-Si:H passivation. Amorphous silicon heterojunction layers on crystalline wafers thus combine low-surface recombination velocity with excellent carrier extraction.


1985 ◽  
Vol 63 (6) ◽  
pp. 870-875 ◽  
Author(s):  
S. Damaskinos ◽  
A. E. Dixon

A scanning laser microscope was used to study the electronic and recombination properties at grain boundaries of both n- and p-type Wacker polycrystalline silicon in a spatially resolved photoconductivity experiment. The light energy falling on the samples was varied over five orders of magnitude from 10−1 to 10−6 mW. For p-type material the measured L decreased with beam intensity from 150 to 60 μm, reaching a constant value at very low beam intensities. The small focal spot of the microscope allowed the measurements to be extended to include n-type samples. Forthese samples L was found to change from 90 to 18 μm with decreasing beam intensity. The surface recombination velocity SGB was evaluated for both samples. For p-type samples it decreased from 25 000 to 6000 cm/s and for n-type samples from 21 000 to 3000 cm/s with decreasing beam intensity. The quasi-Fermi level separation was determined as a function of the excess minority-carrier-concentration density at the grain boundary and found to increase linearly with beam intensity.


2012 ◽  
Vol 1391 ◽  
Author(s):  
Taro Hayakawa ◽  
Yuuki Nakashima ◽  
Koichi Koyama ◽  
Keisuke Ohdaira ◽  
Hideki Matsumura

ABSTRACTPhosphorus (P) doped ultra thin n+-layer is formed on crystalline silicon (c-Si) at low substrate temperatures of 80 – 350 °C using radicals generated by the catalytic reaction of phosphine (PH3) with a tungsten catalyzer heated at 1300 °C. The sheet carrier concentration obtained by Hall effect is in the range between 3×1012cm-2 and 8×1012cm-2. The distribution of P atoms obtained by secondary ion mass spectrometry (SIMS) indicates that P atoms locate within the depth of 4 nm from surface and the profile has almost the same distribution independent of any doping conditions such as substrate temperature or radical exposure time. The sheet carrier concentration is 1.15 – 2.12% of the amount of P atoms incorporated through the radical doping. The ratio of activated donors increases with substrate temperature during the radical doping, suggesting that P-related species bonded on the c-Si surface require thermal energy for their activation. Using the n+-layer formed by radical doping, the reduction of surface recombination velocity for n-type c-Si wafer is attempted. The effective minority carrier lifetime of the n-type c-Si sample covered with 6-nm-thick intrinsic amorphous Si (i-a-Si) layers on both side increases from 32 μs to1576 μs by the radical doping of P atoms to n-type c-Si surface, suggesting that the radical doping can be utilized for the formation of passivation layers on a-Si/ n-c-Si hetero-interface.


1988 ◽  
Vol 66 (3) ◽  
pp. 200-205
Author(s):  
S. Damaskinos ◽  
A. E. Dixon

A scanning laser microscope was used in a spatially resolved photoconductivity experiment to determine the minority-carrier diffusion length (L) and surface-recombination velocity at grain boundaries (SGB) in (i) n- and p-type Wacker polysilicon and (ii) neutron-transmutation-doped Metron polysilicon as a function of beam intensity. Different values of L were measured on opposite sides of the grain boundaries. For the Metron samples, L was measured at the same grain boundary using a series of samples doped to different levels. These samples had dopant concentrations between 1013 and 1017 atoms/cm3. L was found to decrease from 50 to 5 μm, with decreasing beam intensity, reaching a constant value at low beam intensities. L was also found to remain relatively unchanged for low dopant concentrations. The SGB values were found to increase with increasing beam intensity in both Wacker and Metron samples, ranging between 104 and 105 cm/s. L was also measured with a light-beam-induced-current technique (perpendicular geometry) and found to be in close agreement with values obtained using the photoconductivity technique.


1994 ◽  
Vol 33 (Part 1, No.1A) ◽  
pp. 88-89 ◽  
Author(s):  
Hiroshi Ito ◽  
Tadao Ishibashi

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