Thermally induced structural characteristics of pentacene thin films

2009 ◽  
Vol 105 (11) ◽  
pp. 113520 ◽  
Author(s):  
Dong Guo ◽  
Susumu Ikeda ◽  
Koichiro Saiki
Keyword(s):  
Thin Films ◽  
Structural Characteristics ◽  
Thermally Induced

Stresses in Multilayered Thin Films on a Thick Substrate

1987 ◽  
Vol 91 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Thin Films ◽  
Fatigue Strength ◽  
Structural Characteristics ◽  
Normal Stresses ◽  
Thermally Induced ◽  
Heteroepitaxial Structures ◽  
Thick Substrate ◽  
Induced Stresses ◽  
Multilayered Thin Films ◽  
Distribution Of Stresses

ABSTRACTThe analysis contains an engineering method for the prediction of thermally induced stresses in single- and multilayered heteroepitaxial structures on a thick substrate. The examined stresses include 1) normal stresses acting in the film layers themselves and responsible for their ultimate and fatigue strength, and 2) interfacial stresses responsible for film blistering and peeling. The developed formulas are simple, visible, easy-to-use, and clearly indicate how material and structural characteristics affect the magnitude and the distribution of stresses and deflections. Some recommendations for smaller stresses in film structures are presented. The obtained results can be utilized as a guidance for an optimal physical design of multilayered heteroepitaxial structures used in Microelectronics.

An Approximate Analysis of Stresses in Multilayered Elastic Thin Films

1988 ◽  
Vol 55 (1) ◽  
pp. 143-148 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Thin Films ◽  
Structural Characteristics ◽  
Finite Size ◽  
Approximate Analysis ◽  
Normal Stresses ◽  
Approximate Evaluation ◽  
Thermally Induced ◽  
Heteroepitaxial Structures ◽  
Induced Stresses ◽  
Distribution Of Stresses

The analysis contains an engineering method for the approximate evaluation of thermally induced stresses in single and multilayered heteroepitaxial structures fabricated on thick substrates, with consideration of the finite size of the structure. The examined stresses include normal stresses, acting in the film layers themselves and responsible for their ultimate and fatigue strength, as well as interfacial stresses, responsible for film blistering and peeling. The developed formulas are simple, easy-to-use, and clearly indicate how material and structural characteristics affect the magnitude and the distribution of stresses and deflections. Some recommendations for smaller stresses in film structures are presented. The obtained results can be utilized as a guidance for physical design of multilayered heteroepitaxial structures in microelectronics.

Optical and structural characteristics of electrodeposited Cd 1-xZnxS nanostructured thin films

2021 ◽  
Vol 114 ◽  
pp. 110966
Author(s):  
K. Erturk ◽  
M. Isik ◽  
M. Terlemezoglu ◽  
N.M. Gasanly
Keyword(s):  
Thin Films ◽  
Structural Characteristics ◽  
Nanostructured Thin Films

Synthesis and characterization of silver nanoparticle nanocomposite thin films with thermally induced surface morphology changes

2015 ◽  
Vol 159 ◽  
pp. 118-121 ◽  
Author(s):  
Ernandes T. Tenório-Neto ◽  
Marcos R. Guilherme ◽  
Manuel E.G. Winkler ◽  
Lucio Cardozo-Filho ◽  
Stéphani C. Beneti ◽  
...  
Keyword(s):  
Thin Films ◽  
Surface Morphology ◽  
Silver Nanoparticle ◽  
Synthesis And Characterization ◽  
Thermally Induced ◽  
Nanocomposite Thin Films ◽  
Morphology Changes

STRUCTURAL CHARACTERISTICS OF (Ba,Sr)TiO3 THIN FILMS BY RAPID THERMAL ANNEALING

2007 ◽  
Vol 14 (01) ◽  
pp. 141-145
Author(s):  
Q. Y. ZHANG ◽  
S. W. JIANG ◽  
Y. R. LI
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Heating Rate ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Rapid Heating ◽  
Structural Characteristics ◽  
High Heating Rate ◽  
Duration Time ◽  
Temperature Heating

The rapid thermal annealing (RTA) process was adapted to crystallize the amorphous ( Ba,Sr ) TiO 3 thin films prepared on Si (111) substrates by RF magnetic sputtering deposition. The effect of annealing temperature, heating rate and duration time on crystallization was studied through X-ray diffraction and atomic force microscopy. The result shows that the crystallinity and grain size were strongly dependent on the temperature, heating rate, and duration time. Higher heating rate leads to smaller grain size. In high heating rate, the grain size shows different dependence of temperature from that of low heating rate. For a heating rate of 50°C/s, the grain size decreased with temperature increasing below 700°C, while after that temperature, the grain size increased slightly with the temperature increasing. At a certain temperature, the crystallinity and surface roughness improved with increase in annealing time, while grain size changed little. The effect of rapid heating rate on the nucleation and grain growth has been discussed, which contributes to the limited grain size of the annealed ( Ba,Sr ) TiO 3 thin films.

scholarly journals Influence of the growth parameters of TiO2 thin films deposited by the MOCVD method

Cerâmica ◽  
2002 ◽  
Vol 48 (305) ◽  
pp. 38-42 ◽  
Author(s):  
M. I. B. Bernardi ◽  
E. J. H. Lee ◽  
P. N. Lisboa-Filho ◽  
E. R. Leite ◽  
E. Longo ◽  
...  
Keyword(s):  
Thin Films ◽  
Growth Parameters ◽  
Structural Characteristics ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Tio2 Thin Films ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Deposition Parameters

The synthesis of TiO2 thin films was carried out by the Organometallic Chemical Vapor Deposition (MOCVD) method. The influence of deposition parameters used during growth on the final structural characteristics was studied. A combination of the following experimental parameters was studied: temperature of the organometallic bath, deposition time, and temperature and substrate type. The high influence of those parameters on the final thin film microstructure was analyzed by scanning electron microscopy with electron dispersive X-ray spectroscopy, atomic force microscopy and X-ray diffraction.

Effect of Block Copolymer Architecture on the Thermally Induced Swelling of Micelle-Containing Multilayer Thin Films

2011 ◽  
Vol 44 (19) ◽  
pp. 7767-7774 ◽  
Author(s):  
Wui Siew Tan ◽  
Zhichen Zhu ◽  
Svetlana A. Sukhishvili ◽  
Michael F. Rubner ◽  
Robert E. Cohen
Keyword(s):  
Thin Films ◽  
Block Copolymer ◽  
Multilayer Thin Films ◽  
Thermally Induced
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