Effect of the electrical boundary condition at the crack face on the mode I energy release rate in piezoelectric ceramics

2009 ◽  
Vol 94 (8) ◽  
pp. 081902 ◽  
Author(s):  
Yasuhide Shindo ◽  
Fumio Narita ◽  
Mitsuru Hirama
Keyword(s):  
Boundary Condition ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Piezoelectric Ceramics ◽  
Mode I ◽  
Crack Face ◽  
Electrical Boundary Condition

The Dynamic Energy Release Rate for a Steadily Propagating Antiplane Shear Crack in a Linearly Viscoelastic Body

1987 ◽  
Vol 54 (3) ◽  
pp. 635-641 ◽  
Author(s):  
J. R. Walton
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Shear Crack ◽  
Viscoelastic Body ◽  
Antiplane Shear ◽  
Singular Stress ◽  
Crack Face ◽  
Standard Linear Solid ◽  
Dynamic Energy Release Rate

The steady-state propagation of a semi-infinite, antiplane shear crack is reconsidered for a general, infinite, homogeneous and isotropic linearly viscoelastic body. As with an earlier study, the inertial term in the equation of motion is retained and the shear modulus is only assumed to be positive, continuous, decreasing, and convex. A Barenblatt type failure zone is introduced in order to cancel the singular stress, and a numerically convenient expression for the dynamic Energy Release Rate (ERR) is derived for a rather general class of crack face loadings. The ERR is shown to have a complicated dependence on crack speed and material properties with significant qualitative differences between viscoelastic and elastic material. The results are illustrated with numerical calculations for both power-law material and a standard linear solid.

The Edge Delamination Test: Measuring the Critical Adhesion Energy of Thin-Film Coatings, Part II: Mode Mixity & Application

1994 ◽  
Vol 338 ◽  
Author(s):  
Edward O. Shaffer ◽  
Scott A. Sikorski ◽  
Frederick J. McGarry
Keyword(s):  
Thin Film ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Mode I ◽  
Rigid Substrate ◽  
Edge Delamination

ABSTRACTThe edge delamination test (EDT) is being developed to measure the critical energy required to cause a thin film, under biaxial tensile stress, to debond from a rigid substrate[1]. The test uses circular features etched through biaxially stressed films adhered to a rigid substrate. If the stress is large enough, a stable debond ring grows radially about the feature. We use a finite element analysis to model the test, solving for the applied strain energy release rate as a function of crack length, feature hole radius and other geometrical parameters. The model identifies both mode I and mode II components of the strain energy release rate, and agrees with previous analytical solutions for the total debond energy. However, the model predicts, with a very refined mesh at the crack tip, the fracture process is pure mode I. To explore this result, critical strain energy release rates from the EDT and the island blister test (IBT) are compared. This agreement supports the model prediction that the failure process in the EDT is modeI peeling.

scholarly journals Crack Growth and Energy Release Rate for an Angled Crack under Mixed Mode Loading

2020 ◽  
Vol 10 (12) ◽  
pp. 4227
Author(s):  
Yali Yang ◽  
Seok Jae Chu ◽  
Wei song Huang ◽  
Hao Chen
Keyword(s):  
Energy Release Rate ◽  
Numerical Method ◽  
Energy Release ◽  
Release Rate ◽  
Mixed Mode ◽  
Crack Tip ◽  
Theoretical Expression ◽  
Propagation Mechanism ◽  
Mode I ◽  
Theoretical Derivation

The evaluation of energy release rate with angle is still a challenging task in metal crack propagation analysis, especially for the mixed Mode I-II-III loading situation. In this paper, the energy release rate associated with stress intensity factors at an arbitrary angle under mixed mode loadings has been investigated using both a numerical method and theoretical derivation. A relatively simple and precise numerical method was established through a series of spatial-inclined ellipses in Mode I-II and ellipsoids in Mode I-II-III, with different propagation angles computed from simulation. Meanwhile, a theoretical expression of the energy release rate with angle for a crack tip under a I-II-III mixed mode crack was deduced based on the propagation mechanism of the crack tip under the influence of a stress field. It is confirmed that the theoretical expression deduced could provide results as accurately as the present numerical method. The present results were confirmed to be effective and accurate by comparison with experimental data and other literature.

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