Ion drag force on a small grain in highly collisional weakly anisotropic plasma: Effect of plasma production and loss mechanisms

2008 ◽  
Vol 15 (5) ◽  
pp. 053703 ◽  
Author(s):  
M. Chaudhuri ◽  
S. A. Khrapak ◽  
G. E. Morfill
Keyword(s):  
Drag Force ◽  
Anisotropic Plasma ◽  
Plasma Production ◽  
Plasma Effect ◽  
Loss Mechanisms

scholarly journals Drag force in a strongly coupled anisotropic plasma

2012 ◽  
Vol 2012 (8) ◽  
Author(s):  
Mariano Chernicoff ◽  
Daniel Fernández ◽  
David Mateos ◽  
Diego Trancanelli
Keyword(s):  
Drag Force ◽  
Anisotropic Plasma ◽  
Strongly Coupled

Ion drag force on an absorbing grain in highly collisional plasma in the presence of plasma production and loss processes

2008 ◽  
Author(s):  
Manis Chaudhuri ◽  
Sergei A. Khrapak ◽  
Gregor E. Morfill ◽  
José Tito Mendonça ◽  
David P. Resendes ◽  
...  
Keyword(s):  
Drag Force ◽  
Collisional Plasma ◽  
Plasma Production

Anisotropic Plasma ChemicalVapor Deposition of Copper Films in Trenches

2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Anisotropic Plasma ◽  
Bottom Surface ◽  
Chemical Vapor Deposition Method ◽  
Copper Films ◽  
Deposition Method ◽  
Via Holes

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.

Sign in / Sign up

Export Citation Format

Share Document