Residual Stress Estimation of Ti Casting Alloy by X-ray Single Crystal Measurement Method

2008 ◽  
Author(s):  
A. Shiro ◽  
M. Nishida ◽  
T. Jing ◽  
Abarrul Ikram ◽  
Agus Purwanto ◽  
...  
Keyword(s):  
Residual Stress ◽  
Single Crystal ◽  
Measurement Method ◽  
Casting Alloy ◽  
X Ray ◽  
Stress Estimation

S124 Residual Stress Estimation of Ti Casting Alloy by X-ray Single Crystal Measurement Method

2008 ◽  
Vol 23 (2) ◽  
pp. 182-182
Author(s):  
A. Shiro ◽  
T. Hanabusa ◽  
M. Nishida ◽  
T. Jing
Keyword(s):  
Residual Stress ◽  
Single Crystal ◽  
Measurement Method ◽  
Casting Alloy ◽  
X Ray ◽  
Stress Estimation

Stress Estimation of Titanium Casting Alloy by X-Ray Measurement Technique of Single Crystal

2010 ◽  
Vol 652 ◽  
pp. 143-148
Author(s):  
Nishida Masayuki ◽  
Hanabusa Takao ◽  
Ayumi Shiro ◽  
Tatsuya Matsue
Keyword(s):  
Residual Stress ◽  
Single Crystal ◽  
Measurement Technique ◽  
Stress Measurement ◽  
Position Effect ◽  
Casting Alloy ◽  
Diffraction Profile ◽  
Titanium Casting ◽  
X Ray ◽  
Crystal Grains

Residual stresses in titanium casting alloy were estimated by X-ray stress measurement technique. There are two problems in the condition of X-ray stress measurement. Firstly, the titanium casting alloy has the large crystal grains. These coarse grains were generated under solidification processes and those sizes are approximately 2 millimeter in this study. These coarse crystal grains interfere with an accurate stress measurement due to the unstable diffraction profile [1]. This is because the existence of a sufficient number of isotropic crystal grains in the X-ray irradiation area are based on the X-ray diffraction theory. In this study, the stress measurement technique of single crystal materials was adopted for the solution of this fundamental problem [2, 3]. Because the coarse crystal grain was treated as a single crystal, the high intensity diffraction profiles were observed from a certain direction with investigations of crystal orientation. The problem with the coarse crystal grain in titanium casting alloy were cleaned up by the employment of the single crystal measurement technique. Secondly, the results from this study show that the position of crystal grain within the X-ray irradiation area greatly influenced the residual stress values. Therefore, in the present paper the erasing method of this position effect was tried and discussed [4]. Finally, the improvement of the accuracy of this method for the residual stress measurement in titanium casting alloy under the several bending stresses was confirmed. These results show that the erasing method in this study is an effective correction method.

Residual Stress Measurement of Silicon Nitride and Silicon Carbide by X-Ray Diffraction Using Gaussian Curve Method

1988 ◽  
Vol 32 ◽  
pp. 459-469 ◽  
Author(s):  
Masanori Kurita ◽  
Ikuo Ihara ◽  
Nobuyuki Ono
Keyword(s):  
Residual Stress ◽  
Single Crystal ◽  
Elastic Constants ◽  
Stress Measurement ◽  
Polycrystalline Materials ◽  
X Ray Diffraction ◽  
X Ray ◽  
Small Areas ◽  
Curve Method ◽  
The Continuum

The residual stress induced by grinding or some thermal treatment has a large effect on the strength of ceramics. The X-ray technique can be used to nondestructively measure the residual stress in small areas on the surface of polycrystalline materials. The X-ray stress measurement is based on. the continuum mechanics for macroscopically isotropic polycrystalline materials. In this method, the stress value is calculated selectively from strains of a particular diffraction plane in the grains which are favorably oriented for the diffraction. In general, however, the elastic constants of a single crystal depend on the plane of the lattice, since a single crystal is anisotropic, The behavior of the deformation of individual crystals in the aggregate of polycrystalline materials under applied stress has not yet been solved successfully. Therefore, the stress constant and elastic constants for a particular diffracting plane should be determined experimentally in order to determine the residual stress accurately by X-ray diffraction.

Data Collection Requirements for the Analysis of Residual Stress in Polycrystalline Coatings

2006 ◽  
Vol 524-525 ◽  
pp. 795-800 ◽  
Author(s):  
Arnold C. Vermeulen ◽  
Detlev Götz
Keyword(s):  
Residual Stress ◽  
Data Collection ◽  
Single Crystal ◽  
Test Cases ◽  
X Ray Diffraction ◽  
Polycrystalline Specimen ◽  
X Ray ◽  
Data Collection Strategy ◽  
Diffraction Geometry ◽  
Complete Set

Residual stress in polycrystalline coatings can be determined by X-ray diffraction. The data collection requirements are summarized and evaluated in this paper. First, general requirements for stress measurements are described. Then, requirements related to the diffraction geometry and the specimen manipulation are considered. Finally, requirements with respect to specimen characteristics, including various coating-substrate combinations are presented. Polycrystalline coatings can be nanocrystalline, randomly orientated or highly textured. The substrates can be of any nature: amorphous, polycrystalline or single crystal. The complete set of requirements leads to a measurement advice for a particular coatingsubstrate specimen, which includes the choice of diffraction geometry and the data collection strategy. Based on two complementary test cases it is demonstrated that the set of rules is complete and that they can be applied to any type of polycrystalline specimen.

Residual Stress Estimation of Tungsten Film by GIXRD

2008 ◽  
Vol 32 ◽  
pp. 75-78 ◽  
Author(s):  
Chao Chang Arthur Chen ◽  
Wei En Fu ◽  
Meng Ke Chen
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
X Ray Diffraction ◽  
X Ray ◽  
Tungsten Film ◽  
Stress Estimation

Subsurface residual stresses of tungsten films induced by Chemical Mechanical Polishing (CMP) processes were investigated by the Grazing Incident X-Ray Diffraction (GIXRD). Basis of the GIXRD measurement was introduced and the experiments were conducted for residual stress of tungsten film measurements. Experimental procedures of the GIXRD measurements were presented. The obtained residual stresses value of tungsten films from 800 nm to 400 nm varies from 1086.1 ± 105.2 MPa to 1670.6±103.4 MPa prior and after CMP process.

RESIDUAL STRESS ESTIMATION OF BONE TISSUE USING X-RAY IMAGING TECHNIQUE

2007 ◽  
Vol 40 ◽  
pp. S371
Author(s):  
Bijay Giri ◽  
Kazuhiro Fujisaki ◽  
Masahiro Todoh ◽  
Shigeru Tadano
Keyword(s):  
Residual Stress ◽  
Bone Tissue ◽  
Imaging Technique ◽  
X Ray ◽  
X Ray Imaging ◽  
Stress Estimation

X-Ray Measurement for Residual Stress in Cold Ring Rolling

2010 ◽  
Vol 37-38 ◽  
pp. 1647-1650 ◽  
Author(s):  
Zhi Jiang Zuo ◽  
Wu Xin Yu ◽  
Jun Jie Yang
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Stress Distribution ◽  
Measurement Method ◽  
Element Model ◽  
Residual Stress Distribution ◽  
Ring Rolling ◽  
X Ray ◽  
Cold Ring Rolling ◽  
The Finite Element Model

The residual stress in cold rolling could decrease the accuracy of ring parts. Because many factors could cause residual stress, it’s difficult to calculate it theoretically. At present, a measurement method was generally used to study the residual stress. For example, X ray could be used to measure residual stress in rings. Through the measurement of residual stress, it could not only obtain the residual stress level after ring rolling, but also validate the finite element model to predict the residual stress distribution. However, because the ring surface was circle, it needs to cut a plane for X ray measure, and it increases measurement inaccuracy. This method only could be suited for qualitative analysis of residual stress in cold ring rolling, and it is not suitable for quantitative analysis of residual stress distribution.

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