High capacitance density metal-insulator-metal structures based on a high-κ HfNxOy–SiO2–HfTiOy laminate stack

2008 ◽  
Vol 92 (13) ◽  
pp. 132902 ◽  
Author(s):  
V. Mikhelashvili ◽  
P. Thangadurai ◽  
W. D. Kaplan ◽  
G. Eisenstein
2009 ◽  
Vol 95 (11) ◽  
pp. 113502 ◽  
Author(s):  
Yung-Hsien Wu ◽  
Bo-Yu Chen ◽  
Lun-Lun Chen ◽  
Jia-Rong Wu ◽  
Min-Lin Wu

2011 ◽  
Vol 50 (4S) ◽  
pp. 04DF09 ◽  
Author(s):  
Takuya Tsutsumi ◽  
Suehiro Sugitani ◽  
Kazumi Nishimura ◽  
Minoru Ida

2011 ◽  
Vol 50 (4) ◽  
pp. 04DF09 ◽  
Author(s):  
Takuya Tsutsumi ◽  
Suehiro Sugitani ◽  
Kazumi Nishimura ◽  
Minoru Ida

2013 ◽  
Vol 658 ◽  
pp. 116-119
Author(s):  
Ho Young Kwak ◽  
Hyuk Min Kwon ◽  
Sung Kyu Kwon ◽  
Jae Hyung Jang ◽  
Seung Yong Sung ◽  
...  

. In this paper, dielectric relaxation and reliability of high capacitance density metal-insulator-metal (MIM) capacitor using Al2O3-HfO2-Al2O3 sandwiched structure were analyzed. It is shown that multilayer MIM capacitor provides high capacitance density and low dissipation factor at room temperature. The dielectric relaxation voltage shows little dependence on the capacitor area. The capacitance density (C0) increases and quadratic voltage coefficient (α) decreases as a function of stress time under constant voltage stress (CVS) because of the charge trapping effect in the high-k dielectric.


Nanoscale ◽  
2018 ◽  
Vol 10 (37) ◽  
pp. 17983-17989 ◽  
Author(s):  
Christian Stelling ◽  
Stefan Fossati ◽  
Jakub Dostalek ◽  
Markus Retsch

Metal–insulator–metal structures prepared by self-assembly exhibit narrow gap plasmon modes, which are fully described by analytical theory.


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