On Physical Vapor Deposition of CuPc Organic Thin Films in High Gravity

2008 ◽  
Author(s):  
Kh. S. Karimov ◽  
S. Bellingeri ◽  
B. F. Irgaziev ◽  
I. Qazi ◽  
T. A. Khan ◽  
...  
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Organic Thin Films ◽  
High Gravity

Spiral growth mode in DMDPC organic thin film transistors by physical vapor deposition

RSC Advances ◽  
2016 ◽  
Vol 6 (56) ◽  
pp. 50770-50775 ◽  
Author(s):  
Tianjun Liu ◽  
Jiawei Wang ◽  
Liang Wang ◽  
Jing Wang ◽  
Jingbo Lan ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Physical Vapor Deposition ◽  
Organic Thin Films ◽  
Organic Thin Film Transistors ◽  
Spiral Growth ◽  
Organic Thin Film ◽  
Screw Dislocations

We report the observation of a screw-dislocation-driven spiral growth of DMDPC organic thin films. The existence of screw dislocations was clearly confirmed by the observations of outcropped stepsand spiral fringes.

scholarly journals Ultrasmooth Organic Films Via Efficient Aggregation Suppression by a Low-Vacuum Physical Vapor Deposition

Materials ◽  
2021 ◽  
Vol 14 (23) ◽  
pp. 7247
Author(s):  
Youngkwan Yoon ◽  
Jinho Lee ◽  
Seulgi Lee ◽  
Soyoung Kim ◽  
Hee Cheul Choi
Keyword(s):  
Thin Films ◽  
Thermal Energy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Performance ◽  
Film Growth ◽  
High Vacuum ◽  
Organic Thin Films ◽  
Smooth Surfaces ◽  
Adsorbed Molecules

Organic thin films with smooth surfaces are mandated for high-performance organic electronic devices. Abrupt nucleation and aggregation during film formation are two main factors that forbid smooth surfaces. Here, we report a simple fast cooling (FC) adapted physical vapor deposition (FCPVD) method to produce ultrasmooth organic thin films through effectively suppressing the aggregation of adsorbed molecules. We have found that thermal energy control is essential for the spread of molecules on a substrate by diffusion and it prohibits the unwanted nucleation of adsorbed molecules. FCPVD is employed for cooling the horizontal tube-type organic vapor deposition setup to effectively remove thermal energy applied to adsorbed molecules on a substrate. The organic thin films prepared using the FCPVD method have remarkably ultrasmooth surfaces with less than 0.4 nm root mean square (RMS) roughness on various substrates, even in a low vacuum, which is highly comparable to the ones prepared using conventional high-vacuum deposition methods. Our results provide a deeper understanding of the role of thermal energy employed to substrates during organic film growth using the PVD process and pave the way for cost-effective and high-performance organic devices.

Localized Physical Vapor Deposition via Focused Laser Spike Dewetting of Gold Thin Films for Nanoscale Patterning

2018 ◽  
Vol 2 (1) ◽  
pp. 586-597 ◽  
Author(s):  
Tianxing Ma ◽  
Michael P. Nitzsche ◽  
Arielle R. Gamboa ◽  
Valeria Saro-Cortes ◽  
Jonathan P. Singer
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Nanoscale Patterning ◽  
Gold Thin Films

Synthesis of CeB6 thin films by physical vapor deposition and their field emission investigations

2012 ◽  
Vol 177 (1) ◽  
pp. 117-120 ◽  
Author(s):  
J.Q. Xu ◽  
T. Mori ◽  
Y. Bando ◽  
D. Golberg ◽  
D. Berthebaud ◽  
...  
Keyword(s):  
Thin Films ◽  
Field Emission ◽  
Vapor Deposition ◽  
Physical Vapor Deposition

Optoelectronic properties of Sb2S3 thin films grown by Physical Vapor Deposition

2021 ◽  
Author(s):  
J. Cruz-Gomez ◽  
E. Hernandez-Cantero ◽  
D. Santos-Cruz ◽  
S.A. Mayen-Hernandez ◽  
F. DeMoure-Flores ◽  
...  
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Optoelectronic Properties

Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000175-000182
Author(s):  
Carol Putman ◽  
Rachel Cramm Horn ◽  
Ambrose Wolf ◽  
Daniel Krueger
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Reliability ◽  
Interface Energy ◽  
Molecular Stability ◽  
Thin Film Adhesion ◽  
Inorganic Thin Films

Abstract Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high reliability, high density microelectronics. The functionality and robustness of rework has been increased through the incorporation of a Physical Vapor Deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for RF (Radio Frequency) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. While past work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e. thermodynamic) parameters in literature. This paper analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxides coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability over a range of temperatures. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

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