scholarly journals Self-assembled monolayers for reduced temperature direct metal thermocompression bonding

2007 ◽  
Vol 91 (6) ◽  
pp. 061913 ◽  
Author(s):  
X. F. Ang ◽  
F. Y. Li ◽  
W. L. Tan ◽  
Z. Chen ◽  
C. C. Wong ◽  
...  
2007 ◽  
Vol 990 ◽  
Author(s):  
Xiaofang Ang ◽  
Li Cheong Chin ◽  
Guo Ge Zhang ◽  
Jun Wei ◽  
Zhong Chen ◽  
...  

ABSTRACTElevated bonding temperature for interconnection deteriorates the reliability of both the device and the interconnect; hence the imperative for developing low temperature bonding methods. This study investigates the feasibility of using self-assembled monolayers (SAMs) to assist direct gold-gold bonding. This involves a simple molecular self-assembly process whereby a monolayer of alkyl chains with a sulfur end group is attached to the gold surface prior to thermocompression bonding. Using this method, we have achieved gold to gold bonding at a bonding temperature below 100°C, a significant reduction compared to the conventional bonding temperatures of above 150 °C. We attribute this temperature reduction to two properties of SAMs - (1) surface passivation of the Au surface that precludes adsorption of surface contaminants, and (2) The easy displacement of SAMs through thermal desorption just before bonding occurs. This SAMs-assisted bonding mechanism is supported by X-ray photoelectron spectroscopy (XPS) and surface plasmon resonance (SPR) results.


1998 ◽  
Vol 95 (6) ◽  
pp. 1339-1342 ◽  
Author(s):  
R. Michalitsch ◽  
A. El Kassmi ◽  
P. Lang ◽  
A. Yassar ◽  
F. Garnier

2003 ◽  
Vol 104 ◽  
pp. 459-462 ◽  
Author(s):  
R. Klauser ◽  
M. Zharnikov ◽  
I.-H. Hong ◽  
S.-C. Wang ◽  
A. Gölzhäuser ◽  
...  

2009 ◽  
Vol 25 (1) ◽  
pp. 83-86 ◽  
Author(s):  
Guo-Qiang TAN ◽  
Hai-Yang BO ◽  
Hong-Yan MIAO ◽  
Ao XIA ◽  
Zhong-Liang HE

Sign in / Sign up

Export Citation Format

Share Document