Crack Profile Reconstruction by Means of Potential Drop Measurements

2007 ◽  
Author(s):  
G. Sposito ◽  
P. Cawley ◽  
P. B. Nagy
Keyword(s):  
Potential Drop ◽  
Profile Reconstruction ◽  
Crack Profile

Reconstruction of complex shaped crack from ECT signals based on a fast forward solver using an advanced multi-media element

2020 ◽  
Vol 64 (1-4) ◽  
pp. 621-629
Author(s):  
Yingsong Zhao ◽  
Cherdpong Jomdecha ◽  
Shejuan Xie ◽  
Zhenmao Chen ◽  
Pan Qi ◽  
...  
Keyword(s):  
Coefficient Matrix ◽  
Crack Edge ◽  
Numerical Accuracy ◽  
Gauss Point ◽  
Current Testing ◽  
Efficient Simulation ◽  
Shaped Crack ◽  
Multi Media ◽  
Profile Reconstruction ◽  
Crack Profile

In this paper, the conventional database type fast forward solver for efficient simulation of eddy current testing (ECT) signals is upgraded by using an advanced multi-media finite element (MME) at the crack edge for treating inversion of complex shaped crack. Because the analysis domain is limited at the crack region, the fast forward solver can significantly improve the numerical accuracy and efficiency once the coefficient matrices of the MME can be properly calculated. Instead of the Gauss point classification, a new scheme to calculate the coefficient matrix of the MME is proposed and implemented to upgrade the ECT fast forward solver. To verify its efficiency and the feasibility for reconstruction of complex shaped crack, several cracks were reconstructed through inverse analysis using the new MME scheme. The numerical results proved that the upgraded fast forward solver can give better accuracy for simulating ECT signals, and consequently gives better crack profile reconstruction.

Fast crack profile reconstruction using pulsed eddy current signals

2013 ◽  
Vol 54 ◽  
pp. 37-44 ◽  
Author(s):  
Libing Bai ◽  
Gui Yun Tian ◽  
Anthony Simm ◽  
Shulin Tian ◽  
Yuhua Cheng
Keyword(s):  
Eddy Current ◽  
Pulsed Eddy Current ◽  
Profile Reconstruction ◽  
Crack Profile

Corrosion of Electronic and Magnetic Devices and Materials

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel
Keyword(s):  
Thin Film ◽  
Failure Modes ◽  
Galvanic Corrosion ◽  
Potential Drop ◽  
Magnetic Devices ◽  
Disk Structure ◽  
Magnetic Layers ◽  
Ohmic Potential Drop ◽  
Corrosion Problem ◽  
Corrosion Susceptibility

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.

Improved Compliance Solutions for C(T), SE(B) and Clamped SE(T) Specimens Including Side-Grooves, Varying Thicknesses and 3-D Effects

2014 ◽  
Author(s):  
Gustavo Henrique B. Donato ◽  
Felipe Cavalheiro Moreira
Keyword(s):  
Crack Growth ◽  
Plane Strain ◽  
Plane Stress ◽  
Potential Drop ◽  
Crack Size ◽  
Growth Conditions ◽  
Size Estimation ◽  
Unloading Compliance ◽  
Integrity Assessments ◽  
Elastic Unloading

Fracture toughness and Fatigue Crack Growth (FCG) experimental data represent the basis for accurate designs and integrity assessments of components containing crack-like defects. Considering ductile and high toughness structural materials, crack growing curves (e.g. J-R curves) and FCG data (in terms of da/dN vs. ΔK or ΔJ) assumed paramount relevance since characterize, respectively, ductile fracture and cyclic crack growth conditions. In common, these two types of mechanical properties severely depend on real-time and precise crack size estimations during laboratory testing. Optical, electric potential drop or (most commonly) elastic unloading compliance (C) techniques can be employed. In the latter method, crack size estimation derives from C using a dimensionless parameter (μ) which incorporates specimen’s thickness (B), elasticity (E) and compliance itself. Plane stress and plane strain solutions for μ are available in several standards regarding C(T), SE(B) and M(T) specimens, among others. Current challenges include: i) real specimens are in neither plane stress nor plane strain - modulus vary between E (plane stress) and E/(1-ν2) (plane strain), revealing effects of thickness and 3-D configurations; ii) furthermore, side-grooves affect specimen’s stiffness, leading to an “effective thickness”. Previous results from current authors revealed deviations larger than 10% in crack size estimations following existing practices, especially for shallow cracks and side-grooved samples. In addition, compliance solutions for the emerging clamped SE(T) specimens are not yet standardized. As a step in this direction, this work investigates 3-D, thickness and side-groove effects on compliance solutions applicable to C(T), SE(B) and clamped SE(T) specimens. Refined 3-D elastic FE-models provide Load-CMOD evolutions. The analysis matrix includes crack depths between a/W=0.1 and a/W=0.7 and varying thicknesses (W/B = 4, W/B = 2 and W/B = 1). Side-grooves of 5%, 10% and 20% are also considered. The results include compliance solutions incorporating all aforementioned effects to provide accurate crack size estimation during laboratory fracture and FCG testing. All proposals revealed reduced deviations if compared to existing solutions.

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