Production of a helium beam in a focused ion beam machine using an electron beam ion trap

2007 ◽  
Vol 90 (8) ◽  
pp. 083112 ◽  
Author(s):  
F. Ullmann ◽  
F. Großmann ◽  
V. P. Ovsyannikov ◽  
J. Gierak ◽  
G. Zschornack
Author(s):  
Falk Ullmann ◽  
Frank Grossmann ◽  
Vladimir P. Ovsyannikov ◽  
Jacques Gierak ◽  
Eric Bourhis ◽  
...  

Author(s):  
H.J. Ryu ◽  
A.B. Shah ◽  
Y. Wang ◽  
W.-H. Chuang ◽  
T. Tong

Abstract When failure analysis is performed on a circuit composed of FinFETs, the degree of defect isolation, in some cases, requires isolation to the fin level inside the problematic FinFET for complete understanding of root cause. This work shows successful application of electron beam alteration of current flow combined with nanoprobing for precise isolation of a defect down to fin level. To understand the mechanism of the leakage, transmission electron microscopy (TEM) slice was made along the leaky drain contact (perpendicular to fin direction) by focused ion beam thinning and lift-out. TEM image shows contact and fin. Stacking fault was found in the body of the silicon fin highlighted by the technique described in this paper.


Author(s):  
P. Perdu ◽  
G. Perez ◽  
M. Dupire ◽  
B. Benteo

Abstract To debug ASIC we likely use accurate tools such as an electron beam tester (Ebeam tester) and a Focused Ion Beam (FIB). Interactions between ions or electrons and the target device build charge up on its upper glassivation layer. This charge up could trigger several problems. With Ebeam testing, it sharply decreases voltage contrast during Image Fault Analysis and hide static voltage contrast. During ASIC reconfiguration with FIB, it could induce damages in the glassivation layer. Sample preparation is getting a key issue and we show how we can deal with it by optimizing carbon coating of the devices. Coating is done by an evaporator. For focused ion beam reconfiguration, we need a very thick coating. Otherwise the coating could be sputtered away due to imaging. This coating is use either to avoid charge-up on glassivated devices or as a sacrificial layer to avoid short circuits on unglassivated devices. For electron beam Testing, we need a very thin coating, we are now using an electrical characterization method with an insitu control system to obtain the right thin thickness. Carbon coating is a very cheap and useful method for sample preparation. It needs to be tuned according to the tool used.


1998 ◽  
Vol 58 (6) ◽  
pp. 599-604 ◽  
Author(s):  
E Träbert ◽  
P Beiersdorfer ◽  
S B Utter ◽  
J R Crespo López-Urrutia

2001 ◽  
Vol 79 (2-3) ◽  
pp. 153-162 ◽  
Author(s):  
E Träbert ◽  
P Beiersdorfer ◽  
K B Fournier ◽  
S B Utter ◽  
K L Wong

Systematic variation of the electron-beam energy in an electron-beam ion trap has been employed to produce soft-X-ray spectra (20 to 60 Å) of Au with well-defined maximum charge states ranging from Br- to Co-like ions. Guided by large-scale relativistic atomic structure calculations, the strongest Δn = 0 (n = 4 to n' = 4) transitions in Rb- to Cu-like ions (Au42+ – Au50+) have been identified. PACS Nos.: 32.30Rj, 39.30+w, 31.50+w, 32.20R


2001 ◽  
Vol T92 (1) ◽  
pp. 147-149 ◽  
Author(s):  
F. J. Currell ◽  
F. J. Currell ◽  
H. Kuramoto ◽  
S. Ohtani ◽  
C. Scullion ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document