In situ observation of the grain growth of the copper electrodeposits for ultralarge scale integration

2006 ◽  
Vol 89 (16) ◽  
pp. 161924 ◽  
Author(s):  
Hyo-Jong Lee ◽  
Heung Nam Han ◽  
Do Hyun Kim ◽  
Ui-hyoung Lee ◽  
Kyu Hwan Oh ◽  
...  
MRS Advances ◽  
2016 ◽  
Vol 1 (26) ◽  
pp. 1947-1952 ◽  
Author(s):  
Prabhu Balasubramanian ◽  
Chengjian Zheng ◽  
Yixuan Tan ◽  
Genevieve Kane ◽  
Antoinette Maniatty ◽  
...  

ABSTRACTAn integrated experimental – simulation – control theory approach designed to enable adaptive control of microstructural evolution in polycrystalline metals is described. A micro-heater array, containing ten addressable channels, is used to create desired temperature profiles across thin polycrystalline films in situ to a scanning electron microscope (SEM). The goal is that on heating with controlled temperature profiles, the evolution of grain growth within the film can be continuously monitored and compared to Monte Carlo simulations of trajectories towards a desired microstructure. Feed-forward and feedback control strategies are then used to guide the microstructure along the desired trajectory.


2007 ◽  
Vol 990 ◽  
Author(s):  
Chia-Jeng Chung ◽  
David Field ◽  
No-Jin Park ◽  
Christy Woo

ABSTRACTGrain growth in polycrystalline films is controlled by the energetics of the surface, interface and grain boundaries as well as strain energy. The unique character of damascene lines fabricated from electroplated Cu films introduces the additional considerations of bath chemistry and geometric constraints. The moderate stacking fault energy of Cu allows for the development of a substantial twin fraction for certain growth conditions. This paper discusses in-situ observation of grain growth in Cu films and lines under various processing conditions. It is shown that for thicker films and for structures constrained within damascene trenches the energetics of twin boundary formation play a large role in texture development of these structures.


Micron ◽  
2020 ◽  
Vol 131 ◽  
pp. 102825
Author(s):  
Suyun He ◽  
Chunyang Wang ◽  
Lu Qi ◽  
Hengqiang Ye ◽  
Kui Du

2010 ◽  
Vol 638-642 ◽  
pp. 1077-1082 ◽  
Author(s):  
Yasuhiro Yogo ◽  
Kouji Tanaka ◽  
Koukichi Nakanishi

An in-situ observation method for structures at high temperature is developed. The new observation device can reveal grain boundaries at high temperature and enables dynamic observation of these boundaries. Grain growth while maintaining microstructure at high temperature is observed by the new observation device with only one specimen for the entire observation, and grain sizes are quantified. The quantifying process reveals two advantages particular to the use of the new observation device: (1) the ability to quantify grain sizes of specified sizes and (2) the results of average grain size for many grains have significantly less errors because the initial structure is the same for the entire observation and the quantifying process. The new observation device has the function to deform a specimen while observing structures at high temperature, so that enables it to observe dynamic recrystallization of steel. The possibility to observe recrystallization is also shown.


Materialia ◽  
2021 ◽  
Vol 15 ◽  
pp. 100985
Author(s):  
Genki Saito ◽  
Tianglong Zhang ◽  
Norihito Sakaguchi ◽  
Munekazu Ohno ◽  
Kiyotaka Matsuura ◽  
...  

2006 ◽  
Vol 914 ◽  
Author(s):  
Heung Nam Han ◽  
Hyo-Jong Lee ◽  
Do Hyun Kim ◽  
Ui-hyoung Lee ◽  
Pil-Ryung Cha ◽  
...  

AbstractDuring the self-annealing in the copper electrodeposits for the copper metallization, an in-situ observation of grain growth of the copper at room temperature was performed by using EBSD (electron backscatter diffraction). The thin film structure of the copper electrodeposits after annealing was columnar. New twin was initiated at the front surface of growing twin and grew along the normal direction of the twin boundary between the new and parent twins. It was confirmed that the annealing twin in the copper electrodeposits during the self-annealing have an {111} growth front surface.


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