Electron trap level in a GaN nanorod p-n junction grown by molecular-beam epitaxy

2006 ◽  
Vol 88 (19) ◽  
pp. 192104 ◽  
Author(s):  
Y. S. Park ◽  
C. M. Park ◽  
C. J. Park ◽  
H. Y. Cho ◽  
Seung Joo Lee ◽  
...  
2011 ◽  
Vol 295-297 ◽  
pp. 777-780 ◽  
Author(s):  
M. Ajaz Un Nabi ◽  
M. Imran Arshad ◽  
Adnan Ali ◽  
M. Asghar ◽  
M. A Hasan

In this paper we have investigated the substrate-induced deep level defects in bulk GaN layers grown onp-silicon by molecular beam epitaxy. Representative deep level transient spectroscopy (DLTS) performed on Au-GaN/Si/Al devices displayed only one electron trap E1at 0.23 eV below the conduction band. Owing to out-diffusion mechanism; silicon diffuses into GaN layer from Si substrate maintained at 1050°C, E1level is therefore, attributed to the silicon-related defect. This argument is supported by growth of SiC on Si substrate maintained at 1050°C in MBE chamber using fullerene as a single evaporation source.


1987 ◽  
Vol 26 (Part 2, No. 4) ◽  
pp. L266-L269 ◽  
Author(s):  
Koshi Ando ◽  
Chikara Amano ◽  
Hideo Sugiura ◽  
Masafumi Yamaguchi ◽  
Anne Saletes

1993 ◽  
Vol 325 ◽  
Author(s):  
Z.C. Huang ◽  
C.R. Wie ◽  
J.A. Varriano ◽  
M.W. Koch ◽  
G.W. Wicks

AbstractDeep levels in lattice matched Ga0.51In0.49P/GaAs heterostructure have been investigated by thermal-electric effect spectroscopy(TEES) and temperature dependent conductivity measurements. Four samples were grown by molecular beam epitaxy with various phosphorus (P2) beam equivalent pressure(BEP) of 0.125, 0.5, 2, and 4×10−4 Torr. We report for the first time, to our knowledge, an electrical observation of phosphorus vacancy point defects in the GaInP/GaAs material system. The phosphorus vacancies, Vp. behave as an electron trap which is located at EC−0.28±0.02 eV. We have found that this trap dominates the conduction band conduction when T> 220K, and is responsible for the variable-range hopping conduction when T < 220K. Its concentration decreases with the increasing phosphrous BEP. Successive rapid thermal annealing showed that its concentration increases with the increasing annealing temperature. Another electron trap at EC−0.51eV was also observed only in samples with P2 BEP less than 2×10−4 Torr. Its capture cross section is 4.5×10−15 cm 2 as obtained from the illumination time dependent TEES spectra.


Shinku ◽  
1985 ◽  
Vol 28 (7) ◽  
pp. 587-595
Author(s):  
Tamotsu HASHIZUME ◽  
Ryuichi KATSUMI ◽  
Hideo OHNO ◽  
Hideki HASEGAWA

2005 ◽  
Vol 86 (3) ◽  
pp. 032909 ◽  
Author(s):  
D. C. Oh ◽  
T. Suzuki ◽  
J. J. Kim ◽  
H. Makino ◽  
T. Hanada ◽  
...  

Author(s):  
C.B. Carter ◽  
D.M. DeSimone ◽  
T. Griem ◽  
C.E.C. Wood

Molecular-beam epitaxy (MBE) is potentially an extremely valuable tool for growing III-V compounds. The value of the technique results partly from the ease with which controlled layers of precisely determined composition can be grown, and partly from the ability that it provides for growing accurately doped layers.


Author(s):  
D. Loretto ◽  
J. M. Gibson ◽  
S. M. Yalisove ◽  
R. T. Tung

The cobalt disilicide/silicon system has potential applications as a metal-base and as a permeable-base transistor. Although thin, low defect density, films of CoSi2 on Si(111) have been successfully grown, there are reasons to believe that Si(100)/CoSi2 may be better suited to the transmission of electrons at the silicon/silicide interface than Si(111)/CoSi2. A TEM study of the formation of CoSi2 on Si(100) is therefore being conducted. We have previously reported TEM observations on Si(111)/CoSi2 grown both in situ, in an ultra high vacuum (UHV) TEM and ex situ, in a conventional Molecular Beam Epitaxy system.The procedures used for the MBE growth have been described elsewhere. In situ experiments were performed in a JEOL 200CX electron microscope, extensively modified to give a vacuum of better than 10-9 T in the specimen region and the capacity to do in situ sample heating and deposition. Cobalt was deposited onto clean Si(100) samples by thermal evaporation from cobalt-coated Ta filaments.


Author(s):  
S. H. Chen

Sn has been used extensively as an n-type dopant in GaAs grown by molecular-beam epitaxy (MBE). The surface accumulation of Sn during the growth of Sn-doped GaAs has been observed by several investigators. It is still not clear whether the accumulation of Sn is a kinetically hindered process, as proposed first by Wood and Joyce, or surface segregation due to thermodynamic factors. The proposed donor-incorporation mechanisms were based on experimental results from such techniques as secondary ion mass spectrometry, Auger electron spectroscopy, and C-V measurements. In the present study, electron microscopy was used in combination with cross-section specimen preparation. The information on the morphology and microstructure of the surface accumulation can be obtained in a fine scale and may confirm several suggestions from indirect experimental evidence in the previous studies.


Author(s):  
M. E. Twigg ◽  
E. D. Richmond ◽  
J. G. Pellegrino

For heteroepitaxial systems, such as silicon on sapphire (SOS), microtwins occur in significant numbers and are thought to contribute to strain relief in the silicon thin film. The size of this contribution can be assessed from TEM measurements, of the differential volume fraction of microtwins, dV/dν (the derivative of the microtwin volume V with respect to the film volume ν), for SOS grown by both chemical vapor deposition (CVD) and molecular beam epitaxy (MBE).In a (001) silicon thin film subjected to compressive stress along the [100] axis , this stress can be relieved by four twinning systems: a/6[211]/( lll), a/6(21l]/(l1l), a/6[21l] /( l1l), and a/6(2ll)/(1ll).3 For the a/6[211]/(1ll) system, the glide of a single a/6[2ll] twinning partial dislocation draws the two halves of the crystal, separated by the microtwin, closer together by a/3.


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