scholarly journals Surface cleaning and modification of Si(100) substrates by ethanol and water cluster ion beams

2006 ◽  
Vol 77 (3) ◽  
pp. 03B508 ◽  
Author(s):  
Gikan H. Takaoka ◽  
Hidetaka Noguchi ◽  
Kazuya Nakayama ◽  
Takato Seki ◽  
Masakazu Kawashita
Keyword(s):  
Water Cluster ◽  
Surface Cleaning ◽  
Ion Beams ◽  
Cluster Ion Beams ◽  
Cluster Ion

scholarly journals Surface processing using water cluster ion beams

2013 ◽  
Vol 307 ◽  
pp. 33-36 ◽  
Author(s):  
Gikan H. Takaoka ◽  
Hiromichi Ryuto ◽  
Mitsuaki Takeuchi ◽  
Gaku Ichihashi
Keyword(s):  
Water Cluster ◽  
Ion Beams ◽  
Surface Processing ◽  
Cluster Ion Beams ◽  
Cluster Ion

scholarly journals Irradiation effects on solid surfaces by water cluster ion beams

Vacuum ◽  
2009 ◽  
Vol 84 (5) ◽  
pp. 501-504 ◽  
Author(s):  
Hiromichi Ryuto ◽  
Keiji Tada ◽  
Gikan H. Takaoka
Keyword(s):  
Water Cluster ◽  
Ion Beams ◽  
Solid Surfaces ◽  
Irradiation Effects ◽  
Cluster Ion Beams ◽  
Cluster Ion

Lateral Sputtering by Gas Cluster Ion Beams and its Applications to Atomic Level Surface Modification

1995 ◽  
Vol 396 ◽  
Author(s):  
Isao Yamada ◽  
Jiro Matsuo
Keyword(s):  
Ion Beam ◽  
High Vacuum ◽  
Surface Cleaning ◽  
Ion Beams ◽  
Dynamics Simulation ◽  
Average Roughness ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam ◽  
Ion Size

AbstractGas cluster ion beam equipment (max. voltage 30kV) for sputtering has been developed. Cluster ion beams from gaseous materials such as Ar, O2, N2 and compound materials such as SF6, N2O, CO2 can be generated by expanding them through a Laval nozzle into a high-vacuum region. With this equipment sputtering process fundamentals have been studied. One of the unique characteristics of gas cluster ion bombardment is lateral sputtering. This is shown experimentally by measuring the angular distribution of sputtered atoms and is predicted by molecular dynamics simulation. Dependencies of sputtering yield (10-1000 times higher than for the monomer ion case) on cluster ion size and on ion beam energy for different substrate surfaces have been obtained. Examples of surface smoothing (typically less than 1 nm average roughness) on metals, semiconductors and insulators and of surface cleaning are presented.

Cu pattern etching by oxygen gas cluster ion beams with acetic acid vapor

2014 ◽  
Author(s):  
N. Toyoda ◽  
M. Kojima ◽  
R. Hinoura ◽  
A. Yamaguchi ◽  
K. Hara ◽  
...  
Keyword(s):  
Acetic Acid ◽  
Ion Beams ◽  
Acid Vapor ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
Oxygen Gas
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