Thermal contact conductance of ceramic AlN and oxygen-free high-conductivity copper interfaces under low temperature and vacuum for high-temperature superconducting cryocooler cooling

2006 ◽  
Vol 77 (2) ◽  
pp. 024901 ◽  
Author(s):  
Jian Wang ◽  
Huiling Wang ◽  
Hanrui Zhuang
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Thermal Contact ◽  
High Conductivity ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
High Temperature Superconducting

Thermal contact conductance between solid interfaces under low temperature and vacuum

2004 ◽  
Vol 75 (9) ◽  
pp. 3074-3076 ◽  
Author(s):  
Youming Xiao ◽  
Heng Sun ◽  
Lie Xu ◽  
Haidong Feng ◽  
Hongmei Zhu
Keyword(s):  
Low Temperature ◽  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance

Thermal Contact Conductance Across Gold-Coated OFHC Copper Contacts in Different Media

2005 ◽  
Vol 127 (6) ◽  
pp. 657-659 ◽  
Author(s):  
Bapurao Kshirsagar, ◽  
Prashant Misra, ◽  
Nagaraju Jampana, and ◽  
M. V. Krishna Murthy
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Pressure ◽  
Thermal Contact ◽  
High Conductivity ◽  
Thermal Contact Conductance ◽  
Ofhc Copper ◽  
Contact Conductance ◽  
Contact Pressures ◽  
Good Agreement

The thermal contact conductance studies across gold-coated oxygen-free high-conductivity copper contacts have been conducted at different contact pressures in vacuum, nitrogen, and helium environments. It is observed that the thermal contact conductance increases not only with the increase in contact pressure but also with the increase in thermal conductivity of interstitial medium. The experimental data are found to be in good agreement with the literature.

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