A class of micromachined magnetic resonator for high-frequency magnetic sensor applications

2006 ◽  
Vol 99 (8) ◽  
pp. 08B309 ◽  
Author(s):  
Yong-Seok Kim ◽  
Seong-Cho Yu ◽  
Hong Lu ◽  
Jeong-Bong Lee ◽  
Heebok Lee
Keyword(s):  
High Frequency ◽  
Magnetic Sensor ◽  
Sensor Applications ◽  
Magnetic Resonator

scholarly journals Topological Insulator Cell for Memory and Magnetic Sensor Applications

2011 ◽  
Vol 4 (9) ◽  
pp. 094201 ◽  
Author(s):  
Takashi Fujita ◽  
Mansoor Bin Abdul Jalil ◽  
Seng Ghee Tan
Keyword(s):  
Topological Insulator ◽  
Magnetic Sensor ◽  
Sensor Applications

scholarly journals Facile magnetoresistance adjustment of graphene foam for magnetic sensor applications through microstructure tailoring

2020 ◽  
Vol 2 (4) ◽  
pp. 346-352
Author(s):  
Rizwan Ur Rehman Sagar ◽  
Min Zhang ◽  
Xiaohao Wang ◽  
Babar Shabbir ◽  
Florian J. Stadler
Keyword(s):  
Magnetic Sensor ◽  
Graphene Foam ◽  
Sensor Applications

scholarly journals Design and development of ITER high-frequency magnetic sensor

2016 ◽  
Vol 112 ◽  
pp. 594-612 ◽  
Author(s):  
Y. Ma ◽  
G. Vayakis ◽  
L.B. Begrambekov ◽  
J.-J. Cooper ◽  
I. Duran ◽  
...  
Keyword(s):  
High Frequency ◽  
Magnetic Sensor ◽  
Design And Development

Key Technologies Research of MEMS Pressure Sensor for Fuze

2014 ◽  
Vol 472 ◽  
pp. 242-246
Author(s):  
Bo Jiang ◽  
Xing Lin Qi ◽  
Zhi Ning Zhao
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
High Frequency ◽  
Development Trend ◽  
Military Industry ◽  
Key Technology ◽  
Sensor Applications ◽  
Key Technologies ◽  
Mems Technology ◽  
The Development Trend

MEMS technology has been widely used in military industry, in order to further expand the scope of the MEMS pressure sensor applications in military industry, to make fuze development toward miniaturization and intelligent, do the study on special fuze MEMS pressure sensor. Environment of MEMS pressure sensor application in fuze is analyzed, consist service treatment environment and using environment, which can provide indicators for the development of the sensor. The paper analyzes several key technology of the fuze MEMS pressure sensor, including the technique of high temperature resistant, acceleration compensation, leadless, high frequency resistant and overload resistant and so on. To sum up, the continuous development of MEMS technology can make its products meet the use environment of fuze, and the development trend of the fuze also needs the support of MEMS technology, so it is necessary and feasible to carry out the research of the fuze MEMS pressure sensor.

scholarly journals Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000058-000063 ◽  
Author(s):  
Caroline Jacq ◽  
Thomas Maeder ◽  
Benoit R. Ellenrieder ◽  
Philipp Windischhofer ◽  
Xinyue Jiang ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Stability ◽  
Low Temperature ◽  
High Frequency ◽  
Thermal Stresses ◽  
Magnetic Sensor ◽  
Temperature Gradients ◽  
Ceramic Technology ◽  
Vacuum Vessel ◽  
Main Substrate

Abstract To monitor high-frequency fluctuations of the equilibrium magnetic field in tokamaks, a 3D magnetic sensor has been developed. The sensor, which is positioned inside the vacuum vessel behind the protective tiles of the tokamak and is exposed to potential temperatures up to 400°C, is based on thick-film and LTCC (low-temperature co-fired ceramic) technology. To connect the sensor to the cabling that runs inside the vacuum vessel, mineral-insulated cables have to be brazed to the sensor to ensure electrical connection together with mechanical robustness and sufficient thermal stability. As the brazing temperature is about 600°C, direct brazing to the alumina sensor substrate can cause failure by cracking induced by thermal stresses. It arises both by temperature gradients stemming from the localised heating and by the high thermal mismatch of alumina with the braze and wire materials. In previous work, high stresses from temperature gradients were efficiently decoupled by brazing indirectly to alumina beams attached to the main substrate, and local thermal stresses between alumina and braze/wire by using a porous metallisation. However, as the slender alumina beams protruding out of the substrate are somewhat cumbersome and fragile, three alternatives were studied in the present work: 1) testing shorter and more robust beams, 2) replacing the alumina beam by a silver wire, and 3) depositing a porous temperature- and stress-decoupling dielectric to enable direct brazing on the main alumina substrate. These solutions are characterised with respect to their mechanical robustness and of the degree of thermal decoupling with the substrate they provide.

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