Strategy and Software Framework for Integration of QNDE and Product Life Management Design

Author(s):  
John C. Aldrin
2012 ◽  
Vol 236-237 ◽  
pp. 278-282 ◽  
Author(s):  
Chi Hao Yeh ◽  
Ful Chiang Wu ◽  
Ming Jaan Wang

The aim of this paper is to show how to apply TRIZ to resolve conflicts in management area, especially in product life management (PLM) in desinging and manfacturing smart-phone. TRIZ has been well-known as a creative and innovative thinking theory in solving engineering and technology contradictions in the last two decades. However, few studies and practical usage were proposed in management area. Conflicts occurring in product life management including schedule, budget, and risk ones at smart phone R&D process are discussed to demonstrate the ideas guided by 39 TRIZ management parameters, 40 TRIZ innovative principles, and contradiction matrix. The results show that TRIZ is able to provide direct, quick and effective alternatives to resolve the conflicts in PLM. In this manner, huge effort and cost can be saved in further project execution stage. In this paper, an innovative 3C consuming product such as smart-phone is utilized as a case study to describe the proposed TRIZ-based conflicts-solving approaches at PLM stage.


1999 ◽  
Vol 3 (4) ◽  
pp. 10-13 ◽  
Author(s):  
Reid Lifset ◽  
Thomas Lindhqvist
Keyword(s):  

Author(s):  
Ari Nordström

Topic-based technical documentation is all the rage these days, made popular by DITA and others. Topics can be integrated with the engineering data for the products both describe using nifty Product Life Management (PLM) tools that make this easier than ever. But what if you're stuck with SGML, voluntarily or involuntarily? Can you, too, bring your content into the topic-based paradigm or should you rather not? This paper explores your options and the state of SGML in the PLM world today. It nose-dives into the ATA iSpec 2200 SGML, discusses some of the pains to implement it, and finally converts the ATA to DITA.


2008 ◽  
Author(s):  
Philip McCallion ◽  
Lisa A. Ferretti
Keyword(s):  
New York ◽  

Author(s):  
Da-Yin Liao

Contemporary 300mm semiconductor manufacturing systems have highly automated and digitalized cyber-physical integration. They suffer from the profound problems of integrating large, centralized legacy systems with small islands of automation. With the recent advances in disruptive technologies, semiconductor manufacturing has faced dramatic pressures to reengineer its automation and computer integrated systems. This paper proposes a Distributed-Ledger, Edge-Computing Architecture (DLECA) for automation and computer integration in semiconductor manufacturing. Based on distributed ledger and edge computing technologies, DLECA establishes a decentralized software framework where manufacturing data are stored in distributed ledgers and processed locally by executing smart contracts at the edge nodes. We adopt an important topic of automation and computer integration for semiconductor research &development (R&D) operations as the study vehicle to illustrate the operational structure and functionality, applications, and feasibility of the proposed DLECA software framework.


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