scholarly journals Revision of (sub)nanosecond pulser for IRI Van de Graaff electron accelerator aided by field propagation calculations

2005 ◽  
Vol 76 (2) ◽  
pp. 024702 ◽  
Author(s):  
L. H. Luthjens ◽  
M. J. W. Vermeulen ◽  
M. L. Hom ◽  
M. J. de Loos ◽  
S. B. van der Geer
1966 ◽  
Vol 40 (1) ◽  
pp. 131-135
Author(s):  
O. Dehoust ◽  
H. Baierl ◽  
E. Hesse

Author(s):  
A. Strojnik ◽  
J.W. Scholl ◽  
V. Bevc

The electron accelerator, as inserted between the electron source (injector) and the imaging column of the HVEM, is usually a strong lens and should be optimized in order to ensure high brightness over a wide range of accelerating voltages and illuminating conditions. This is especially true in the case of the STEM where the brightness directly determines the highest resolution attainable. In the past, the optical behavior of accelerators was usually determined for a particular configuration. During the development of the accelerator for the Arizona 1 MEV STEM, systematic investigation was made of the major optical properties for a variety of electrode configurations, number of stages N, accelerating voltages, 1 and 10 MEV, and a range of injection voltages ϕ0 = 1, 3, 10, 30, 100, 300 kV).


Author(s):  
K. F. Russell ◽  
L. L. Horton

Beams of heavy ions from particle accelerators are used to produce radiation damage in metal alloys. The damaged layer extends several microns below the surface of the specimen with the maximum damage and depth dependent upon the energy of the ions, type of ions, and target material. Using 4 MeV heavy ions from a Van de Graaff accelerator causes peak damage approximately 1 μm below the specimen surface. To study this area, it is necessary to remove a thickness of approximately 1 μm of damaged metal from the surface (referred to as “sectioning“) and to electropolish this region to electron transparency from the unirradiated surface (referred to as “backthinning“). We have developed electropolishing techniques to obtain electron transparent regions at any depth below the surface of a standard TEM disk. These techniques may be applied wherever TEM information is needed at a specific subsurface position.


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