Synthesis of cobalt nanoparticles by ion implantation and effects of postimplantation annealing

2004 ◽  
Vol 96 (8) ◽  
pp. 4444-4450 ◽  
Author(s):  
L. G. Jacobsohn ◽  
M. E. Hawley ◽  
D. W. Cooke ◽  
M. F. Hundley ◽  
J. D. Thompson ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Cobalt Nanoparticles ◽  
Postimplantation Annealing

SYNCHROTRON RADIATION CHARACTERIZATION OF COBALT NANOPARTICLES FORMED BY ION IMPLANTATION

2008 ◽  
Vol 01 (02) ◽  
pp. 189-196
Author(s):  
D. J. SPROUSTER ◽  
R. GIULIAN ◽  
P. KLUTH ◽  
L. L. ARAUJO ◽  
G. J. FORAN ◽  
...  
Keyword(s):  
Synchrotron Radiation ◽  
Ion Implantation ◽  
Cobalt Nanoparticles

scholarly journals Formation and Characterization of Cobalt Nanoparticles in Silica by Ion Implantation

2011 ◽  
Vol 17 (S2) ◽  
pp. 1882-1883
Author(s):  
A Malik ◽  
K Belay ◽  
D Llewellyn ◽  
W Hutchison ◽  
R Elliman
Keyword(s):  
Ion Implantation ◽  
Cobalt Nanoparticles

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

The Luminescent Properties of Ion-Implantation-Fabricated SiO2:nc-Si Nanostructures Annealed at High Temperatures

2003 ◽  
Vol 777 ◽  
Author(s):  
David I. Tetelbaum ◽  
Oleg N. Gorshkov ◽  
Alexandr P. Kasatkin ◽  
Vladimir A. Burdov ◽  
Sergey A. Trushin ◽  
...  
Keyword(s):  
Quantum Dot ◽  
Ion Implantation ◽  
High Temperatures ◽  
Radiative Recombination ◽  
Annealing Temperature ◽  
Ostwald Ripening ◽  
Luminescent Properties ◽  
Implantation Dose ◽  
Postimplantation Annealing ◽  
Si Nanostructures

AbstractThe influence of the Si+ implantation dose and postimplantation annealing temperature on the photoluminescence (PL) intensity of silicon nanoinclusions in an SiO2 matrix was experimentally investigated. The way that the PL varied with dose and annealing temperature was explained on the basis of a model which takes into account the Ostwald ripening of nanocrystals and effect of the quantum dot size on the rate of radiative recombination.

Ion-Implantation Studies of Graphite

1982 ◽  
Vol 20 ◽  
Author(s):  
B.S. Elman ◽  
M. Hom ◽  
E.W. Maby ◽  
M.S. Dresselhaus
Keyword(s):  
Raman Spectroscopy ◽  
Elevated Temperature ◽  
Ion Implantation ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Pyrolytic Graphite ◽  
Structural Disorder ◽  
Postimplantation Annealing ◽  
Lattice Damage ◽  
Secondary Ion

ABSTRACTIon implantation of highly oriented pyrolytic graphite (HOPG) is studied using various characterization techniques, including Raman spectroscopy and Secondary Ion Mass Spectroscopy (SIMS). Particular attention is given to the annealing of the implantation-induced lattice damage using both hot substrate implantation (200 < T1< 1000°C) and postimplantation annealing. The Raman spectra provide detailed information on the implantation-induced structural disorder by analysis of the disorder-induced and Raman-allowed features in the first- and second-order spectra. SIMS measurements show that the implanted profile is essentially the same for hot substrate and room temperature implantation for the case of HOPG. It is shown that implantation at elevated temperatures prevents amorphization more effectively than implantation at room temperature and subsequent annealing at the same elevated temperature. The annealing results show that fundamentally different defects are created during room temperature and hot substrate implantation.

Electron Diffraction Analysis of Microtwin Structures in Regrown (III) Silicon

1982 ◽  
Vol 40 ◽  
pp. 460-461
Author(s):  
P. Ling ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
Electron Diffraction ◽  
Ion Implantation ◽  
Diffraction Analysis ◽  
Diffraction Pattern ◽  
Direct Consequence ◽  
The Other ◽  
Electron Diffraction Analysis ◽  
Defect Microstructures ◽  
Ion Implanted

The defect microstructures of Si arising from ion implantation and subsequent regrowth for a (111) substrate have been found to be dominated by microtwins. Figure 1(a) is a typical diffraction pattern of annealed ion-implanted (111) Si showing two groups of extra diffraction spots; one at positions (m, n integers), the other at adjacent positions between <000> and <220>. The object of the present paper is to show that these extra reflections are a direct consequence of the microtwins in the material.

Interlayer mixing in GaAs/AlxGa1-xAs heterostructures as a result of Se+ ion implantation

1988 ◽  
Vol 46 ◽  
pp. 908-909
Author(s):  
E.G. Bithell ◽  
W.M. Stobbs
Keyword(s):  
Ion Implantation ◽  
Diffusion Coefficients ◽  
Dark Field ◽  
Atomic Mass ◽  
Composition Profile ◽  
Semiconductor Heterostructures ◽  
Transmission Electron ◽  
Microscope Images ◽  
Damage Process ◽  
Electron Energy Loss

It is well known that the microstructural consequences of the ion implantation of semiconductor heterostructures can be severe: amorphisation of the damaged region is possible, and layer intermixing can result both from the original damage process and from the enhancement of the diffusion coefficients for the constituents of the original composition profile. A very large number of variables are involved (the atomic mass of the target, the mass and energy of the implant species, the flux and the total dose, the substrate temperature etc.) so that experimental data are needed despite the existence of relatively well developed models for the implantation process. A major difficulty is that conventional techniques (e.g. electron energy loss spectroscopy) have inadequate resolution for the quantification of any changes in the composition profile of fine scale multilayers. However we have demonstrated that the measurement of 002 dark field intensities in transmission electron microscope images of GaAs / AlxGa1_xAs heterostructures can allow the measurement of the local Al / Ga ratio.

Dynamic studies of silicide-mediated crystallization of amorphous silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1352-1353
Author(s):  
C. Hayzelden ◽  
J. L. Batstone
Keyword(s):  
Ion Implantation ◽  
Solid Phase ◽  
Metallic Phase ◽  
Single Crystal Substrate ◽  
Free Electrons ◽  
Melt Temperature ◽  
Transmission Electron ◽  
Crystal Substrate ◽  
High Resolution Tem

Epitaxial reordering of amorphous Si(a-Si) on an underlying single-crystal substrate occurs well below the melt temperature by the process of solid phase epitaxial growth (SPEG). Growth of crystalline Si(c-Si) is known to be enhanced by the presence of small amounts of a metallic phase, presumably due to an interaction of the free electrons of the metal with the covalent Si bonds near the growing interface. Ion implantation of Ni was shown to lower the crystallization temperature of an a-Si thin film by approximately 200°C. Using in situ transmission electron microscopy (TEM), precipitates of NiSi2 formed within the a-Si film during annealing, were observed to migrate, leaving a trail of epitaxial c-Si. High resolution TEM revealed an epitaxial NiSi2/Si(l11) interface which was Type A. We discuss here the enhanced nucleation of c-Si and subsequent silicide-mediated SPEG of Ni-implanted a-Si.Thin films of a-Si, 950 Å thick, were deposited onto Si(100) wafers capped with 1000Å of a-SiO2. Ion implantation produced sharply peaked Ni concentrations of 4×l020 and 2×l021 ions cm−3, in the center of the films.

Analysis of Silicon-On-Insulator Structures Formed By Oxygen Ion Implantation

1985 ◽  
Vol 43 ◽  
pp. 300-301
Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Dose ◽  
Crystal Silicon ◽  
Oxygen Ion ◽  
Oxygen Ion Implantation

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.

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