A Precision Grinding Machine for Diffusion Studies

1954 ◽  
Vol 25 (9) ◽  
pp. 865-868 ◽  
Author(s):  
Harry Letaw ◽  
Lawrence M. Slifkin ◽  
William M. Portnoy
Keyword(s):  
Precision Grinding ◽  
Diffusion Studies ◽  
Grinding Machine

scholarly journals A “Double Accuracy Theory” and Experimental Research on Precision Grinding

2020 ◽  
Vol 10 (6) ◽  
pp. 2030
Author(s):  
Lai Hu ◽  
Yipeng Li ◽  
Jun Zha ◽  
Yaolong Chen
Keyword(s):  
High Speed ◽  
Coordinate Measuring Machine ◽  
Precision Grinding ◽  
Machined Parts ◽  
Accuracy Theory ◽  
Machine Theory ◽  
Ultra Precision ◽  
Measuring Machine ◽  
Grinding Machine ◽  
Multi Body

In the global machining industry, ultra-precision/ultra-high-speed machining has become a challenge, and its requirements are getting higher and higher. The challenge of precision grinding lies in the difficulty in ensuring the various dimensions and geometric accuracy of the final machined parts. This paper mainly uses the theory of a multi-body system to propose a “double accuracy” theory of manufacturing and measurement. Firstly, the grinding theory with an accuracy of 0.1 μm and the precision three-coordinate measuring machine theory with an accuracy of 0.3 μm are deduced. Secondly, the two theories are analyzed. Aiming to better explain the practicability of the “double accuracy” theory, a batch of motorized spindle parts is processed by a grinding machine. Then the precision three-coordinate measuring machine is used to measure the shape and position tolerances such as the roundness, the squareness, the flatness, and the coaxiality. The results show that the reached roundness of part A and B is 5 μm and 0.5 μm, the squareness is 3 μm and 4.5 μm, and the coaxiality tolerance is 1.2 μm, respectively.

Structural Analysis of a Grinding Machine with Linear Motion Guide Applied

2013 ◽  
Vol 336-338 ◽  
pp. 1014-1019
Author(s):  
Seon Yeol Oh ◽  
Han Seok Bang ◽  
B. Y. Choi ◽  
Woo Chun Choi ◽  
S. J. Cho
Keyword(s):  
Finite Element ◽  
Structural Analysis ◽  
Structural Design ◽  
Element Model ◽  
Linear Motion ◽  
Precision Grinding ◽  
Base Side ◽  
Ultra Precision ◽  
Linear Motion Guide ◽  
Grinding Machine

A finite element model of an ultra-precision grinding machine that can have high precision and high stiffness is constructed and structural analysis is done with equivalent stiffnesses of linear motion guides by after structural design and the deformation of the grinding machine is obtained. In order to reduce the deformation of the grinding machine that causes bad influence, structural complement is conducted by adding ribs at the lower part of the column. Also, the straightness of the grinding machine is improved by lifting that the base side of the column.

Ultra Precision Grinding of Wafer Scale

2012 ◽  
Vol 516 ◽  
pp. 257-262
Author(s):  
Martin Hünten ◽  
Fritz Klocke ◽  
Olaf Dambon ◽  
Benjamin Bulla
Keyword(s):  
Tungsten Carbide ◽  
Surface Topography ◽  
Precision Grinding ◽  
Wafer Scale ◽  
Advantages And Disadvantages ◽  
Grinding Processes ◽  
Ultra Precision ◽  
Grinding Tool ◽  
Glass Optics ◽  
Grinding Machine

Manufacturing moulds for the wafer-scale replication of precision glass optics sets new demands in terms of grinding tool lifetime and the processes to be applied. This paper will present different approaches to grinding processes and kinematics to machine wafer-scale tungsten carbide moulds with diameters of up to 100 mm and more than 100 single aspheric cavities, each featuring form accuracies in the micron range. The development of these processes will be described and advantages and disadvantages of the approaches derived from practical tests performed on an ultra precision grinding machine (Moore Nanotech 350FG) will be discussed. Finally, a comparison between the developed processes is made where achieved form accuracies and surface topography are analyzed.

Advances in Quality and Productivity in Precision Grinding: A Review of Selected Research

2016 ◽  
Author(s):  
Xun Chen ◽  
Michael N. Morgan
Keyword(s):  
Removal Rate ◽  
Technology Research ◽  
Precision Grinding ◽  
Grinding Processes ◽  
Machine Performance ◽  
Manufacturing Productivity ◽  
Grinding Machine ◽  
High Removal Rate ◽  
Intelligent Process ◽  
Intelligent Process Control

This paper reviews grinding research led by Professor W Brian Rowe at Liverpool John Moores University and at other establishments previously. Research reviewed extends over fundamentals of grinding processes and machine performance carried out over fifty-five years. Topics range from accuracy in centreless grinding and other grinding processes to grinding machine behaviour and high precision grinding machine design including bearing technology. Research also ranges to high-removal rate grinding processes, surface integrity and intelligent process control. This review highlights progress in selected areas and demonstrates that improving product quality allows improved manufacturing productivity.

Research on Block Thin Film Hydrostatic Guide Rail of Precision Grinding Machine for Optical Manufacturing

2012 ◽  
Vol 479-481 ◽  
pp. 1510-1514
Author(s):  
Tao Jiang ◽  
Yin Biao Guo
Keyword(s):  
Thin Film ◽  
Large Scale ◽  
Design Calculation ◽  
Guide Rail ◽  
Precision Grinding ◽  
Optical Lens ◽  
Stiffness Design ◽  
Grinding Machine ◽  
Optical Manufacturing

2MK-1760 is a grinding machine used in large scale optical lens manufacturing. To meet the manufacturing requirements, the block thin film hydrostatic guide rail is applied. In this paper, the structure of block thin film hydrostatic guide rail is proposed. In order to get the thickness and the stiffness, design calculation is performed. Experiments are carried out to verify that the feasibility and the validity of this technique.

Three-Dimensional Slit Width Measurement for Long Precision Slot Dies

2005 ◽  
Vol 295-296 ◽  
pp. 343-348 ◽  
Author(s):  
M. Furukawa ◽  
Wei Gao ◽  
Hideki Shimizu ◽  
S. Kiyono ◽  
M. Yasutake ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Slit Width ◽  
Precision Grinding ◽  
Repeatability Error ◽  
Measurement Results ◽  
Surface Flatness ◽  
Width Measurement ◽  
Slot Die ◽  
Laser Probes ◽  
Grinding Machine

This paper describes a measurement method for three-dimensional (3D) slit width deviations of long precision slot dies, which are essential for process control in manufacturing. A sensor unit consisting of two laser probes with their measurement axes aligned along the same Z-directional line but with opposite measurement directions, is placed between the two parts of the slot die to scan the two opposing surfaces of the parts along the X- and Y-axes. The variation of the sum of the laser probe outputs, which shows the deviation of the distance between the two surfaces, corresponds to the deviation of the slit width in the Z-direction. The 3D slit width deviations can be obtained accurately through scanning the entire surface in the X Y plane. In addition, the surface flatness of the parts can also be measured accurately by adding one more probe. Measurement experiments have been conducted on a precision grinding machine. The measurement results have indicated that the 3D slit width deviations and flatness can be measured with a repeatability error of less than 1 micron, which meets the requirement for quality control of slot dies.

Stick-Slip Simulation of Feeding System in Silicon Ultra-Precision Grinding Machine

2012 ◽  
Vol 566 ◽  
pp. 530-533
Author(s):  
Zhi Hua Sha ◽  
Shao Xing Zhang ◽  
Yi Wang ◽  
Sheng Fang Zhang
Keyword(s):  
Surface Quality ◽  
Silicon Wafer ◽  
Crystalline Silicon ◽  
Virtual Prototype ◽  
Feeding System ◽  
Precision Grinding ◽  
Stick Slip ◽  
Machining Precision ◽  
Ultra Precision ◽  
Grinding Machine

Mono-crystalline silicon is the typical substrate material in integrated circuits manufacturing, and machining precision and surface quality of the silicon wafer impacts on the quality and performance of the electronic products directly. Silicon grinding technology has high accuracy, low cost and can obtained high surface quality, which has become the mainstream of silicon ultra-precision machining. Stick-slip of feeding system in silicon ultra-precision grinding machine is an important factor which influencing the machining precision of the silicon wafer. In this paper, based on the structure analysis of feeding system in a certain type of silicon ultra-precision grinding machine, the rigid body coupling virtual prototype model of the feeding system is established using ADAMS, the factors which influencing the stick-slip is analyzed deeply via the dynamic simulation of the virtual prototype.

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