scholarly journals Assignment of the OH In‐Plane Deformation Frequency

1956 ◽  
Vol 25 (4) ◽  
pp. 778-778 ◽  
Author(s):  
S. Krimm ◽  
C. Y. Liang ◽  
G. B. B. M. Sutherland
Keyword(s):  
Plane Deformation ◽  
Deformation Frequency

scholarly journals The Out‐of‐Plane Deformation Frequency of the NH Group in the Peptide Link

1953 ◽  
Vol 21 (3) ◽  
pp. 570-571 ◽  
Author(s):  
H. K. Kessler ◽  
G. B. B. M. Sutherland
Keyword(s):  
Plane Deformation ◽  
Out Of Plane ◽  
Deformation Frequency

Delamination in the scoring and folding of paperboard

TAPPI Journal ◽  
2012 ◽  
Vol 11 (1) ◽  
pp. 61-66 ◽  
Author(s):  
DOEUNG D. CHOI ◽  
SERGIY A. LAVRYKOV ◽  
BANDARU V. RAMARAO
Keyword(s):  
Finite Element ◽  
Plane Deformation ◽  
Strain Analysis ◽  
Local Strain ◽  
Uniaxial Stress ◽  
Material Model ◽  
Element Model ◽  
Plastic Behavior ◽  
Stress Strain ◽  
Strain Fields

Delamination between layers occurs during the creasing and subsequent folding of paperboard. Delamination is necessary to provide some stiffness properties, but excessive or uncontrolled delamination can weaken the fold, and therefore needs to be controlled. An understanding of the mechanics of delamination is predicated upon the availability of reliable and properly calibrated simulation tools to predict experimental observations. This paper describes a finite element simulation of paper mechanics applied to the scoring and folding of multi-ply carton board. Our goal was to provide an understanding of the mechanics of these operations and the proper models of elastic and plastic behavior of the material that enable us to simulate the deformation and delamination behavior. Our material model accounted for plasticity and sheet anisotropy in the in-plane and z-direction (ZD) dimensions. We used different ZD stress-strain curves during loading and unloading. Material parameters for in-plane deformation were obtained by fitting uniaxial stress-strain data to Ramberg-Osgood plasticity models and the ZD deformation was modeled using a modified power law. Two-dimensional strain fields resulting from loading board typical of a scoring operation were calculated. The strain field was symmetric in the initial stages, but increasing deformation led to asymmetry and heterogeneity. These regions were precursors to delamination and failure. Delamination of the layers occurred in regions of significant shear strain and resulted primarily from the development of large plastic strains. The model predictions were confirmed by experimental observation of the local strain fields using visual microscopy and linear image strain analysis. The finite element model predicted sheet delamination matching the patterns and effects that were observed in experiments.

Improved anisotropy and piezoelectricity by applying in-plane deformation in monolayer WS2

2021 ◽  
Author(s):  
Ling Li ◽  
Peiting Wen ◽  
Yujue Yang ◽  
Nengjie Huo ◽  
Jingbo Li
Keyword(s):  
Plane Deformation ◽  
New Strategy

This study demonstrates a new strategy to engineer monolayer WS2 by applying in-plane deformation for larger anisotropy and superior piezoelectricity.

scholarly journals Characterization and ballistic performance of thin pre-damaged resin-starved aramid-fiber composite panels

2021 ◽  
pp. 004051752110134
Author(s):  
Cerise A Edwards ◽  
Stephen L Ogin ◽  
David A Jesson ◽  
Matthew Oldfield ◽  
Rebecca L Livesey ◽  
...  
Keyword(s):  
Fiber Composite ◽  
Plane Deformation ◽  
Ballistic Impact ◽  
Image Correlation ◽  
Composite Panel ◽  
Composite Panels ◽  
Micro Computed Tomography ◽  
Ballistic Performance ◽  
Low Level ◽  
Out Of Plane

Military personnel use protective armor systems that are frequently exposed to low-level damage, such as non-ballistic impact, wear-and-tear from everyday use, and damage during storage of equipment. The extent to which such low-level pre-damage could affect the performance of an armor system is unknown. In this work, low-level pre-damage has been introduced into a Kevlar/phenolic resin-starved composite panel using tensile loading. The tensile stress–strain behavior of this eight-layer material has been investigated and has been found to have two distinct regions; these have been understood in terms of the microstructure and damage within the composite panels investigated using micro-computed tomography and digital image correlation. Ballistic testing carried out on pristine (control) and pre-damaged panels did not indicate any difference in the V50 ballistic performance. However, an indication of a difference in response to ballistic impact was observed; the area of maximal local out-of-plane deformation for the pre-damaged panels was found to be twice that of the control panels, and the global out-of-plane deformation across the panel was also larger.

scholarly journals In-Process Measurement of Three-Dimensional Deformations Based on Speckle Photography

2021 ◽  
Vol 11 (11) ◽  
pp. 4981
Author(s):  
Andreas Tausendfreund ◽  
Dirk Stöbener ◽  
Andreas Fischer
Keyword(s):  
Evaluation Method ◽  
Process Analysis ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Machining Process ◽  
Image Correlation ◽  
Speckle Photography ◽  
Process Measurement ◽  
Out Of Plane ◽  
Plane Deformations

In the concept of the process signature, the relationship between a material load and the modification remaining in the workpiece is used to better understand and optimize manufacturing processes. The basic prerequisite for this is to be able to measure the loads occurring during the machining process in the form of mechanical deformations. Speckle photography is suitable for this in-process measurement task and is already used in a variety of ways for in-plane deformation measurements. The shortcoming of this fast and robust measurement technique based on image correlation techniques is that out-of-plane deformations in the direction of the measurement system cannot be detected and increases the measurement error of in-plane deformations. In this paper, we investigate a method that infers local out-of-plane motions of the workpiece surface from the decorrelation of speckle patterns and is thus able to reconstruct three-dimensional deformation fields. The implementation of the evaluation method enables a fast reconstruction of 3D deformation fields, so that the in-process capability remains given. First measurements in a deep rolling process show that dynamic deformations underneath the die can be captured and demonstrate the suitability of the speckle method for manufacturing process analysis.

Inverse algorithm for out-of-plane deformation in shearography

2021 ◽  
Vol 53 (1) ◽  
Author(s):  
Shuangle Wu ◽  
Fangyuan Sun ◽  
Haotian Xie ◽  
Qihan Zhao ◽  
Peizheng Yan ◽  
...  
Keyword(s):  
Plane Deformation ◽  
Inverse Algorithm ◽  
Out Of Plane
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