Use of Pure Copper as a Standard Substance for Low Temperature Calorimetry

1967 ◽  
Vol 38 (12) ◽  
pp. 1738-1740 ◽  
Author(s):  
Douglas L. Martin
Keyword(s):  
Low Temperature ◽  
Pure Copper ◽  
Standard Substance ◽  
Low Temperature Calorimetry

Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation

2012 ◽  
Vol 152-154 ◽  
pp. 183-187 ◽  
Author(s):  
Quang Cherng Hsu ◽  
Yen Yu Cheng ◽  
Bao Hsin Liu
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Bonding Strength ◽  
High Speed ◽  
Tensile Force ◽  
Pure Aluminum ◽  
Pure Copper ◽  
Dynamics Simulation ◽  
Low Speed ◽  
Speed Condition

According to MD simulation results, pressing depth between two bonding materials will affect bonding strength. Alloy material (Al0.9Cu0.1) had void defect phenomenon in low bonding speed condition because the increasing chance of atom migration which will result in low bonding strength. High tensile speed causes material fracture phenomena happen earlier than low speed. Material stress in low speed is smaller than in high speed. Fracture morphology of material is different in different tensile speed. In low speed condition, material can be stretched thinner than in high speed condition. Material in high temperature has greater kinetic energy than low temperature; therefore, material in high temperature has better formability and behaves larger tensile strain than low temperature. For pure aluminum, when temperature raises to 900K which is close to melting point (933K), its crystal structure is no longer belongs to F.C.C. structure, so bonding strength is weaker than low temperature. Large size material has larger contact area than small size material; therefore, the tensile force and tensile strength of the former are larger than the latter. The order of bonding strength for these three materials is: binary alloy > pure copper > pure aluminum.

On the interpretation of low temperature calorimetry data

2007 ◽  
Vol 41 (1) ◽  
pp. 213-224 ◽  
Author(s):  
A. M. Kjeldsen ◽  
M. R. Geiker
Keyword(s):  
Low Temperature ◽  
Low Temperature Calorimetry ◽  
Calorimetry Data

Growth and characterization of ZnSe for low temperature calorimetry applications

1993 ◽  
Vol 128 (1-4) ◽  
pp. 646-649 ◽  
Author(s):  
F. Allegretti ◽  
A. Carrara ◽  
S. Pizzini
Keyword(s):  
Low Temperature ◽  
Low Temperature Calorimetry

scholarly journals Neutrino mass and low-temperature calorimetry

1998 ◽  
Vol 66 (7) ◽  
pp. 574-583
Author(s):  
Sun-chong Wang ◽  
Jun-wei Zhou ◽  
O. Redi ◽  
H. H. Stroke ◽  
N. Coron ◽  
...  
Keyword(s):  
Low Temperature ◽  
Neutrino Mass ◽  
Low Temperature Calorimetry

A silicon on sapphire thermometer for small sample low temperature calorimetry

Physica B+C ◽  
1981 ◽  
Vol 107 (1-3) ◽  
pp. 327-328 ◽  
Author(s):  
S.R. Early ◽  
F. Hellman ◽  
J. Marshall ◽  
T.H. Geballe
Keyword(s):  
Low Temperature ◽  
Small Sample ◽  
Low Temperature Calorimetry
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