Infrared Techniques for Fused Salts

1964 ◽  
Vol 35 (9) ◽  
pp. 1206-1207 ◽  
Author(s):  
Alan Bandy ◽  
J. Paul Devlin ◽  
Ronald Burger ◽  
Billy McCoy
Keyword(s):  
Fused Salts ◽  
Infrared Techniques

Complex ions in fused salts

1960 ◽  
Author(s):  
Harmon Mark Garfinkel
Keyword(s):  
Complex Ions ◽  
Fused Salts

ChemInform Abstract: CATALYTIC CURRENTS IN FUSED SALTS- DISCHARGE MECHANISM OF NITRITE IN MOLTEN ALKALI NITRATES(II)

1978 ◽  
Vol 9 (31) ◽  
Author(s):  
F. PALMISANO ◽  
L. SABBATINI ◽  
E. DESIMONI ◽  
P. G. ZAMBONIN
Keyword(s):  
Discharge Mechanism ◽  
Fused Salts

Prevention of Viral Transmission by Infrared Techniques

2021 ◽  
Author(s):  
Baki Karaböce ◽  
Ahsen Aydın Böyük ◽  
Evren Saban ◽  
Ahmet Baş
Keyword(s):  
Viral Transmission ◽  
Infrared Techniques

Development and Research of Copper Covering for Intensification of Cold Stamping of Products from Stainless Steels

2021 ◽  
Vol 316 ◽  
pp. 809-813
Author(s):  
Vladimir V. Karzhavin ◽  
Lev V. Maltsev ◽  
Viktoriya V. Bakina
Keyword(s):  
High Temperature ◽  
Acid Solution ◽  
Sulphuric Acid ◽  
Stainless Steels ◽  
Diffusion Zone ◽  
Pure Copper ◽  
Sulphuric Acid Solution ◽  
Fused Salts ◽  
Substitution Type ◽  
Cold Stamping

The copper covering put in fused salts of chlorides at temperature of 450-500cC and preventing scuffs on the surface of steel of type 12X18H10T at cold stamping of case products and fixture was investigated. Metallurgical surveys have shown: 1) except cover zone and zone of base metal there is also transition zone, representing substitution type of solution; 2) in the course of application there is superficial alloying, due to penetration of atoms of copper deep into metal and diffusions of doping steel elements in coating material under the influence of melts's high temperature. The schedule of change of concentration of copper in diffusion zone allows to conclude that the copper covering consists not of pure copper, and that the alloy contains only 94% of copper; other 6% represent the chrome and the titanium diffusing in copper covering. It is established also that, despite strong cohesion with basis, the covering is completely removed from surface of the stamping details being dissolved in standard sulphuric acid solution.

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