The Thermal Expansion Coefficient and the Melting Point of Cubic Elements

1950 ◽  
Vol 21 (9) ◽  
pp. 936-936 ◽  
Author(s):  
M. E. Straumanis
Keyword(s):  
Thermal Expansion ◽  
Melting Point ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient

High temperature dielectric constant of KI

1969 ◽  
Vol 47 (9) ◽  
pp. 969-973 ◽  
Author(s):  
Suresh Chandra
Keyword(s):  
Dielectric Constant ◽  
Thermal Expansion ◽  
High Temperature ◽  
Melting Point ◽  
Thermal Expansion Coefficient ◽  
Standing Wave ◽  
Expansion Coefficient ◽  
Room Temperature ◽  
Polarization Effects ◽  
Complex Polarization

The dielectric constant of KI crystal has been measured at 23.6 GHz from room temperature to near the melting point. A K-band microwave standing wave ratio technique was used for this purpose to avoid complex polarization effects. It was found that the dielectric constant of KI increases more rapidly than for KCl and KBr, presumably due to its larger thermal expansion coefficient at high temperatures.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

scholarly journals Alternative of bone china and porcelain as ceramic hand molds for rubber latex glove films formation via dipping process

2020 ◽  
Vol 59 (1) ◽  
pp. 523-537
Author(s):  
Chaturaphat Tharasana ◽  
Aniruj Wongaunjai ◽  
Puwitoo Sornsanee ◽  
Vichasharn Jitprarop ◽  
Nuchnapa Tangboriboon
Keyword(s):  
Thermal Expansion ◽  
Flexural Strength ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Mold Surface ◽  
Rubber Latex ◽  
Latex Glove ◽  
Bone China ◽  
Synthetic Rubber ◽  
Natural And Synthetic

AbstractIn general, the main compositions of porcelain and bone china composed of 54-65%wt silica (SiO2), 23-34% wt alumina (Al2O3) and 0.2-0.7%wt calcium oxide (CaO) suitable for preparation high quality ceramic products such as soft-hard porcelain products for teeth and bones, bioceramics, IC substrate and magneto-optoelectroceramics. The quality of ceramic hand mold is depended on raw material and its properties (pH, ionic strength, solid-liquid surface tension, particle size distribution, specific surface area, porosity, density, microstructure, weight ratio between solid and water, drying time, and firing temperatures). The suitable firing conditions for porcelain and bone china hand-mold preparation were firing at 1270°C for 10 h which resulted in superior working molds for making latex films from natural and synthetic rubber. The obtained fired porcelain hand molds at 1270°C for 10 h provided good chemical durability (10%NaOH, 5%HCl and 10%wtNaCl), low thermal expansion coefficient (5.8570 × 10−6 (°C−1)), good compressive (179.40 MPa) and good flexural strength (86 MPa). While thermal expansion coefficient, compressive and flexural strength of obtained fired bone china hand molds are equal to 6.9230 × 10−6 (°C−1), 128.40 and 73.70 MPa, respectively, good acid-base-salt resistance, a smooth mold surface, and easy hand mold fabrication. Both obtained porcelain and bone china hand molds are a low production cost, making them suitable for natural and synthetic rubber latex glove formation.

scholarly journals Modeling the effects of loading scenario and thermal expansion coefficient on potential failure of cryo-compressed hydrogen vessels

2020 ◽  
Vol 45 (46) ◽  
pp. 24883-24894 ◽  
Author(s):  
Ba Nghiep Nguyen ◽  
Daniel R. Merkel ◽  
Kenneth I. Johnson ◽  
David W. Gotthold ◽  
Kevin L. Simmons ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Potential Failure
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