High-power characteristics of GaN/InGaN double heterojunction bipolar transistors

2004 ◽  
Vol 84 (11) ◽  
pp. 1964-1966 ◽  
Author(s):  
Toshiki Makimoto ◽  
Yoshiharu Yamauchi ◽  
Kazuhide Kumakura
2003 ◽  
Vol 798 ◽  
Author(s):  
Toshiki Makimoto ◽  
Yoshiharu Yamauchi ◽  
Kazuhide Kumakura

ABSTRACTWe have investigated high-power characteristics of GaN/InGaN double heterojunction bipolar transistors on SiC substrates grown by metalorganic vapor phase epitaxy. The p-InGaN extrinsic base layers were regrown to improve ohmic characteristics of the base. Base-collector diodes showed low leakage current at their reverse bias voltages due to a wide bandgap of a GaN collector, resulting in a high-voltage transistor operation. A 90 μm × 50 μm device operated up to a collector-emitter voltage of 28 V and a collector current of 0.37 A in its common-emitter current-voltage characteristics at room temperature, which corresponds to a DC power of 10.4 W. A collector current density and a power density are as high as 8.2 kA/cm2 and 230 kW/cm2, respectively. These results show that nitride HBTs are promising for high-power electronic devices.


1996 ◽  
Vol 32 (4) ◽  
pp. 393 ◽  
Author(s):  
M. Yoneyama ◽  
E. Sano ◽  
S. Yamahata ◽  
Y. Matsuoka ◽  
M. Yaita

2021 ◽  
Vol 130 (3) ◽  
pp. 034502
Author(s):  
Xin Wen ◽  
Akshay Arabhavi ◽  
Wei Quan ◽  
Olivier Ostinelli ◽  
Chhandak Mukherjee ◽  
...  

2009 ◽  
Vol 30 (11) ◽  
pp. 1119-1121 ◽  
Author(s):  
Shyh-Chiang Shen ◽  
Yi-Che Lee ◽  
Hee-Jin Kim ◽  
Yun Zhang ◽  
Suk Choi ◽  
...  

2004 ◽  
Vol 833 ◽  
Author(s):  
Byoung-Gue Min ◽  
Jong-Min Lee ◽  
Seong-Il Kim ◽  
Chul-Won Ju ◽  
Kyung-Ho Lee

ABSTRACTA significant degradation of current gain of InP/InGaAs/InP double heterojunction bipolar transistors was observed after passivation. The amount of degradation depended on the degree of surface exposure of the p-type InGaAs base layer according to the epi-structure and device structure. The deposition conditions such as deposition temperature, kinds of materials (silicon oxide, silicon nitride and aluminum oxide) and film thickness were not major variables to affect the device performance. The gain reduction was prevented by the BOE treatment before the passivation. A possible explanation of this behavior is that unstable non-stoichiometric surface states produced by excess In, Ga, or As after mesa etching are eliminated by BOE treatment and reduce the surface recombination sites.


AIP Advances ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 085320
Author(s):  
Dominique Coquillat ◽  
Alexandre Duhant ◽  
Meriam Triki ◽  
Virginie Nodjiadjim ◽  
Agnieszka Konczykowska ◽  
...  

2014 ◽  
Vol 116 (16) ◽  
pp. 164509 ◽  
Author(s):  
Han-Wei Chiang ◽  
Johann C. Rode ◽  
Prateek Choudhary ◽  
Mark J. W. Rodwell

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