Fracture strength of ultrananocrystalline diamond thin films—identification of Weibull parameters

2003 ◽  
Vol 94 (9) ◽  
pp. 6076-6084 ◽  
Author(s):  
H. D. Espinosa ◽  
B. Peng ◽  
B. C. Prorok ◽  
N. Moldovan ◽  
O. Auciello ◽  
...  
Keyword(s):  
Thin Films ◽  
Fracture Strength ◽  
Weibull Parameters ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films

Strength of Ultrananocrystalline Diamond Thin films – Identification of Weibull Parameters

2003 ◽  
Vol 778 ◽  
Author(s):  
B. Peng ◽  
H.D. Espinosa ◽  
N. Moldovan ◽  
X. Xiao ◽  
O. Auciello ◽  
...  
Keyword(s):  
Thin Films ◽  
Fracture Strength ◽  
Weibull Modulus ◽  
Chemical Vapor ◽  
Probability Of Failure ◽  
Weibull Parameters ◽  
Diamond Particles ◽  
Ultrananocrystalline Diamond ◽  
Micron Size

AbstractThe fracture strength of ultrananocrystalline diamond (UNCD) thin films, grown by microwaveplasma- enhanced chemical-vapor deposition (PECVD), was measured using the membrane deflection experiment (MDE) developed by Espinosa and coworkers. The data show that UNCD fracture strength appears to follow a Weibull distribution. Furthermore, we show that the Weibull parameters are highly dependent on the seeding process used in the growth of the films. When seeding was performed with micron-size diamond particles, using mechanical polishing of the substrate, the stress, resulting in a probability of failure of 67%, was found to be 1.74 GPa, and the Weibull modulus was 5.74. By contrast, when seeding was performed with nano-size diamond particles, using ultrasonic agitation, the stress, resulting in a probability of failure of 67%, increased to 4.13 GPa and the Weibull modulus was 10.76. The investigation highlights the role of microfabrication defects on material properties and reliability, as a function of seeding technique, when identical PECVD chemistry is employed. The parameters identified in this study are expected to aid the designer of MEMS/NEMS devices employing UNCD films.

Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices

2003 ◽  
Vol 43 (3) ◽  
pp. 256-268 ◽  
Author(s):  
H. D. Espinosa ◽  
B. C. Prorok ◽  
B. Peng ◽  
K. H. Kim ◽  
N. Moldovan ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films

scholarly journals Cell Growth on Different Types of Ultrananocrystalline Diamond Thin Films

2012 ◽  
Vol 3 (3) ◽  
pp. 588-600 ◽  
Author(s):  
Bing Shi ◽  
Qiaoling Jin ◽  
Liaohai Chen ◽  
Amina S. Woods ◽  
Albert J. Schultz ◽  
...  
Keyword(s):  
Thin Films ◽  
Cell Growth ◽  
Ultrananocrystalline Diamond ◽  
Different Types ◽  
Diamond Thin Films

Materials science and fabrication processes for a new MEMS technology based on ultrananocrystalline diamond thin films

2004 ◽  
Vol 16 (16) ◽  
pp. R539-R552 ◽  
Author(s):  
Orlando Auciello ◽  
James Birrell ◽  
John A Carlisle ◽  
Jennifer E Gerbi ◽  
Xingcheng Xiao ◽  
...  
Keyword(s):  
Thin Films ◽  
Materials Science ◽  
Ultrananocrystalline Diamond ◽  
Mems Technology ◽  
Diamond Thin Films

Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices

2001 ◽  
Vol 10 (11) ◽  
pp. 1952-1961 ◽  
Author(s):  
A.R. Krauss ◽  
O. Auciello ◽  
D.M. Gruen ◽  
A. Jayatissa ◽  
A. Sumant ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Assembly ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films

Ultrananocrystalline Diamond Thin Films Functionalized with Therapeutically Active Collagen Networks

2009 ◽  
Vol 113 (10) ◽  
pp. 2966-2971 ◽  
Author(s):  
Houjin Huang ◽  
Mark Chen ◽  
Paola Bruno ◽  
Robert Lam ◽  
Erik Robinson ◽  
...  
Keyword(s):  
Thin Films ◽  
Ultrananocrystalline Diamond ◽  
Diamond Thin Films
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