Structural properties and electrical characteristics of electron-beam gun evaporated erbium oxide films

2002 ◽  
Vol 80 (12) ◽  
pp. 2156-2158 ◽  
Author(s):  
V. Mikhelashvili ◽  
G. Eisenstein ◽  
F. Edelmann
1980 ◽  
Vol 1 ◽  
Author(s):  
T. O. Yep ◽  
R. T. Fulks ◽  
R. A. Powell

ABSTRACTSuccessful annealing of p+ n arrays fabricated by ion-implantation of 11B (50 keV, 1 × 1014 cm-2) into Si (100 has been performed using a broadly rastered, low-resolution (0.25-inch diameter) electron beam. A complete 2" wafer could be uniformly annealed in ≃20 sec with high electrical activation (>75%) and small dopant redistribution (≃450 Å). Annealing resulted In p+n junctions characterized by low reverse current (≃4 nAcm-2 at 5V reverse bias) and higher carrier lifetime (80 μsec) over the entire 2" wafer. Based on the electrical characteristics of the diodes, we estimate that the electron beam anneal was able to remove ion implantation damage and leave an ordered substrate to a depth of 5.5 m below the layer junction.


2016 ◽  
Vol 61 (11) ◽  
pp. 1744-1746 ◽  
Author(s):  
D. N. Redka ◽  
N. V. Mukhin ◽  
I. G. Zakharov

2018 ◽  
Vol 24 (S1) ◽  
pp. 1810-1811 ◽  
Author(s):  
Krishna Kanth Neelisetty ◽  
Sebastian Gutsch ◽  
Falk von Seggern ◽  
Alan Molinari ◽  
Alexander Vahl ◽  
...  

1999 ◽  
Vol 468 (1) ◽  
pp. 121-126 ◽  
Author(s):  
Yong-Cheol Kim ◽  
Bodo Quint ◽  
Rudolf W. Kessler ◽  
Dieter Oelkrug

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