Energy dispersive x-ray diffractometry as a tool alternative to differential scanning calorimetry for investigating polymer phase transitions

2002 ◽  
Vol 80 (5) ◽  
pp. 775-777 ◽  
Author(s):  
V. Rossi-Albertini ◽  
A. Isopo ◽  
R. Caminiti ◽  
U. Tentolini
Author(s):  
James Mohr ◽  
Eileen Sullivan ◽  
Paul Deal ◽  
Michael Seddon

Abstract The presence of gold within a Sn/Pb solder joint accelerates diffusion between the Sn and Ni of the Ni- V/Cu underlying bump metallurgy (UBM), generating early failures. A concentration of 1.2 wt% gold in the solder joint can accelerate time to failure by a factor of 400 [3]. The EDS x-ray microanalysis detection limit for gold in tin / lead solder of about 1.2 wt% gold was found to be above the concentration range of interest (0.1 – 0.5 wt% gold). Due to the reliability impact that even a low concentration of gold can have on solder joints employing Ni-V/Cu UBM, a method using differential scanning calorimetry (DSC) was developed to accurately measure gold concentrations of less than 1 wt% in solder bumps.


2015 ◽  
Vol 44 (42) ◽  
pp. 18447-18458 ◽  
Author(s):  
M. Węcławik ◽  
P. Szklarz ◽  
W. Medycki ◽  
R. Janicki ◽  
A. Piecha-Bisiorek ◽  
...  

Dipyrazolium iodide triiodide, [C3N2H5+]2[I−·I3−], has been synthesized and studied by means of X-ray diffraction, differential scanning calorimetry, dielectric measurements, and UV-Vis spectroscopy.


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