Investigation of the mechanism of current density increase in volume sources of hydrogen negative ions at cesium adding

2002 ◽  
Vol 73 (3) ◽  
pp. 1157-1160 ◽  
Author(s):  
V. P. Goretsky ◽  
A. V. Ryabtsev ◽  
I. A. Soloshenko ◽  
A. F. Tarasenko ◽  
A. I. Shchedrin
Keyword(s):  
Current Density ◽  
Negative Ions ◽  
Density Increase ◽  
Current Density Increase

scholarly journals The impact of local current density increase on conductor destruction

2019 ◽  
Vol 1147 ◽  
pp. 012033 ◽  
Author(s):  
S I Krivosheev ◽  
Yu E Adamian ◽  
D I Alekseev ◽  
S G Magazinov ◽  
L V Chernenkaya ◽  
...  
Keyword(s):  
Current Density ◽  
Density Increase ◽  
Local Current Density ◽  
Current Density Increase ◽  
Local Current ◽  
The Impact

Design Rules for Oxygen Evolution Catalysis at Porous Iron Oxide Electrodes: A 1000-Fold Current Density Increase

ChemSusChem ◽  
2017 ◽  
Vol 10 (18) ◽  
pp. 3644-3651 ◽  
Author(s):  
Sandra Haschke ◽  
Dmitrii Pankin ◽  
Yuri Petrov ◽  
Sebastian Bochmann ◽  
Alina Manshina ◽  
...  
Keyword(s):  
Iron Oxide ◽  
Oxygen Evolution ◽  
Current Density ◽  
Density Increase ◽  
Porous Iron ◽  
Design Rules ◽  
Current Density Increase ◽  
Oxide Electrodes

10 MA cm−2 current density in nanoscale conductive bridge threshold switching selector via densely localized cation sources

2021 ◽  
Author(s):  
Qi Lin ◽  
Jinlong Feng ◽  
Junhui Yuan ◽  
Long Liu ◽  
Jason K. Eshraghian ◽  
...  
Keyword(s):  
Current Density ◽  
Density Increase ◽  
Current Density Increase ◽  
Threshold Switching ◽  
Cation Layer ◽  
Conductive Bridge

Super-ionic cation layer was introduced into the CBTS selector to realize ten-fold current density increase.

Activated Prominences; Mechanisms for Activation and Eruption

1979 ◽  
Vol 44 ◽  
pp. 307-313
Author(s):  
D.S. Spicer
Keyword(s):  
Pressure Gradient ◽  
Density Gradient ◽  
Current Density ◽  
Convective Instability ◽  
Tearing Mode ◽  
Magnetic Shear ◽  
Long Wavelength ◽  
Ideal Mhd ◽  
Gradient Change ◽  
Accelerated Particles

A possible relationship between the hot prominence transition sheath, increased internal turbulent and/or helical motion prior to prominence eruption and the prominence eruption (“disparition brusque”) is discussed. The associated darkening of the filament or brightening of the prominence is interpreted as a change in the prominence’s internal pressure gradient which, if of the correct sign, can lead to short wavelength turbulent convection within the prominence. Associated with such a pressure gradient change may be the alteration of the current density gradient within the prominence. Such a change in the current density gradient may also be due to the relative motion of the neighbouring plages thereby increasing the magnetic shear within the prominence, i.e., steepening the current density gradient. Depending on the magnitude of the current density gradient, i.e., magnetic shear, disruption of the prominence can occur by either a long wavelength ideal MHD helical (“kink”) convective instability and/or a long wavelength resistive helical (“kink”) convective instability (tearing mode). The long wavelength ideal MHD helical instability will lead to helical rotation and thus unwinding due to diamagnetic effects and plasma ejections due to convection. The long wavelength resistive helical instability will lead to both unwinding and plasma ejections, but also to accelerated plasma flow, long wavelength magnetic field filamentation, accelerated particles and long wavelength heating internal to the prominence.

Microstructural characterization of YBa2Cu3O7-x thin films formed by metalorganic CVD

1991 ◽  
Vol 49 ◽  
pp. 1080-1081
Author(s):  
P. Lu ◽  
W. Huang ◽  
C.S. Chern ◽  
Y.Q. Li ◽  
J. Zhao ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Film Growth ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Ion Milling ◽  
Conventional Grinding

The YBa2Cu3O7-x thin films formed by metalorganic chemical vapor deposition(MOCVD) have been reported to have excellent superconducting properties including a sharp zero resistance transition temperature (Tc) of 89 K and a high critical current density of 2.3x106 A/cm2 or higher. The origin of the high critical current in the thin film compared to bulk materials is attributed to its structural properties such as orientation, grain boundaries and defects on the scale of the coherent length. In this report, we present microstructural aspects of the thin films deposited on the (100) LaAlO3 substrate, which process the highest critical current density.Details of the thin film growth process have been reported elsewhere. The thin films were examined in both planar and cross-section view by electron microscopy. TEM sample preparation was carried out using conventional grinding, dimpling and ion milling techniques. Special care was taken to avoid exposure of the thin films to water during the preparation processes.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

Microstructure Development in a High Current Density NbTi Superconducting Composite

1985 ◽  
Vol 43 ◽  
pp. 186-189
Author(s):  
P. J. Lee ◽  
D. C. Larbalestier
Keyword(s):  
Current Density ◽  
High Current Density ◽  
Cold Drawing ◽  
Heat Treatments ◽  
Grain Structure ◽  
Fine Grain ◽  
Boundary Film ◽  
Quantitative Basis ◽  
Cold Worked ◽  
Very High

Several features of the metallurgy of superconducting composites of Nb-Ti in a Cu matrix are of interest. The cold drawing strains are generally of order 8-10, producing a very fine grain structure of diameter 30-50 nm. Heat treatments of as little as 3 hours at 300 C (∼ 0.27 TM) produce a thin (1-3 nm) Ti-rich grain boundary film, the precipitate later growing out at triple points to 50-100 nm dia. Further plastic deformation of these larger a-Ti precipitates by strains of 3-4 produces an elongated ribbon morphology (of order 3 x 50 nm in transverse section) and it is the thickness and separation of these precipitates which are believed to control the superconducting properties. The present paper describes initial attempts to put our understanding of the metallurgy of these heavily cold-worked composites on a quantitative basis. The composite studied was fabricated in our own laboratory, using six intermediate heat treatments. This process enabled very high critical current density (Jc) values to be obtained. Samples were cut from the composite at many processing stages and a report of the structure of a number of these samples is made here.

Facet Topography and Dislocation Structure as a Possible Source for Electrical Heterogeneity in [001] TILT Bicrystals of YBa2Cu3O7-δ

1996 ◽  
Vol 54 ◽  
pp. 338-339
Author(s):  
I-Fei Tsu ◽  
D.L. Kaiser ◽  
S.E. Babcock
Keyword(s):  
Grain Boundary ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Electromagnetic Properties ◽  
Length Scale ◽  
Density Values ◽  
Current Densities ◽  
Applied Fields ◽  
A Current

A current theme in the study of the critical current density behavior of YBa2Cu3O7-δ (YBCO) grain boundaries is that their electromagnetic properties are heterogeneous on various length scales ranging from 10s of microns to ˜ 1 Å. Recently, combined electromagnetic and TEM studies on four flux-grown bicrystals have demonstrated a direct correlation between the length scale of the boundaries’ saw-tooth facet configurations and the apparent length scale of the electrical heterogeneity. In that work, enhanced critical current densities are observed at applied fields where the facet period is commensurate with the spacing of the Abrikosov flux vortices which must be pinned if higher critical current density values are recorded. To understand the microstructural origin of the flux pinning, the grain boundary topography and grain boundary dislocation (GBD) network structure of [001] tilt YBCO bicrystals were studied by TEM and HRTEM.

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