Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current

2001 ◽  
Vol 79 (24) ◽  
pp. 3971-3973 ◽  
Author(s):  
H. H. Lin ◽  
S. L. Cheng ◽  
L. J. Chen ◽  
Chih Chen ◽  
K. N. Tu
Keyword(s):  
High Density ◽  
Silicon On Insulator ◽  
Density Current ◽  
Dopant Activation

Dopant activation of heavily doped silicon-on-insulator by high density currents

1999 ◽  
Vol 86 (3) ◽  
pp. 1552-1557 ◽  
Author(s):  
Chih Chen ◽  
J. S. Huang ◽  
C. N. Liao ◽  
K. N. Tu
Keyword(s):  
High Density ◽  
Silicon On Insulator ◽  
Density Currents ◽  
Dopant Activation ◽  
Doped Silicon ◽  
Heavily Doped

Magnetic structure of nickel nanowires after the high-density current pulse

2016 ◽  
Vol 58 (5) ◽  
pp. 946-951 ◽  
Author(s):  
N. I. Nurgazizov ◽  
D. A. Bizyaev ◽  
A. A. Bukharaev
Keyword(s):  
Magnetic Structure ◽  
Current Pulse ◽  
High Density ◽  
Density Current ◽  
Nickel Nanowires

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Daiki Saito ◽  
Kazuhiko Sasagawa ◽  
Takeshi Moriwaki ◽  
Kazuhiro Fujisaki
Keyword(s):  
Grain Growth ◽  
Current Density ◽  
High Density ◽  
Metal Nanoparticle ◽  
Density Current ◽  
Ag Nanoparticle ◽  
Severe Problem ◽  
Atomic Transport ◽  
Current Loading ◽  
Nanoparticle Ink

Abstract Flexible printed circuits (FPCs) are widely used in electronic equipment such as mobile devices and wearable sensors. The conductive electric lines in these circuits are printed using nanoparticle metal ink and ink-jet direct write methods. Physical characteristics such as flexibility and mechanical durability of metal nanoparticle ink lines have been evaluated by bending or tensile tests. In contrast, the electrical characteristics of these lines have not been sufficiently evaluated, and the failure mechanism under high-density current has not been clarified. When electric devices are scaled down, current density and Joule heating increase in conductive lines and electromigration (EM) damage becomes a severe problem. Therefore, reducing the EM damage is extremely important to enhance the device reliability. In this study, a failure analysis of Ag nanoparticle ink lines were assessed using current loading tests and microscopic observations to discuss the damage mechanism and evaluate electrical reliability under high-density current. Atomic transport due to EM was observed at 60 kA/cm2 current loading, and relatively large aggregates and grain growth were observed at 120 kA/cm2 current loading. The time to open circuit was longer at 120 kA/cm2 than at 60 kA/cm2. The formation of large aggregates and unstable changes in the potential drop were observed at the two values of current density. It is considered that aggregate formation and grain growth affected the atomic transport by EM.

scholarly journals Electrical explosion process and amorphous structure of carbon fibers under high-density current pulse igniting intense electron-beam accelerator

2009 ◽  
Vol 27 (3) ◽  
pp. 511-520 ◽  
Author(s):  
Limin Li ◽  
Lie Liu ◽  
Guoxin Cheng ◽  
Lei Chang ◽  
Hong Wan ◽  
...  
Keyword(s):  
Electron Beam ◽  
Current Pulse ◽  
Carbon Fibers ◽  
Electrical Explosion ◽  
High Energy ◽  
High Density ◽  
Density Current ◽  
Explosion Process ◽  
Intense Electron Beam ◽  
Intense Electron

AbstractThe development of pulsed power technology, particularly for inductive energy storage, promotes the extensive discussions of electrical explosion process in high energy density. This paper presents the electrical-explosion behavior of carbon fibers subjected to about 20 kA, ~5 µs high-density current pulse igniting an intense electron beam accelerator. After electrical explosion, and surface rupture, submicron particles, fibrillar and strip-shaped structures were observed, experimentally supporting the microstructure model (skin-core heterogeneity) of carbon fiber. Interestingly, the start and turn-off of the current were followed by radiation pulses with different intensities. It was found that the radiation was focused on the explosion stage which was characterized by an oscillating current. The instabilities of plasma produced during the explosion process play an important role in the microstructure changes of carbon fibers and the radiation generation.

Evening Panel Session (November 16, 1983) Soi Technologies for Integrated Circuits

1983 ◽  
Vol 23 ◽  
Author(s):  
John C. C. Fan ◽  
Y. Akasaka ◽  
G. W. Cullen ◽  
J. F. Gibbons ◽  
C. Hill ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
High Density ◽  
Silicon On Insulator ◽  
Panel Session ◽  
Near Term

There are a number of viable approaches to silicon-on-insulator (SOI) technologies, and the panel session has assembled a number of leaders in the SOI community for their views of “SOI Technologies for Integrated Circuits.” Their viewpoints, shown in tabulated form, were presented for general discussion in the session which was attended by about 150 people. Although SOI technologies are useful for many applications, most of the panelists agreed that the most appropriate near-term applications are for high-speed, high-density integrated circuits. Various SOI technologies, including silicon-on-sapphire (SOS), are currently in the running, but the majority of the panelists felt that for SOI technologies to be widely adopted, SOI must be available as a proven manufactured product within two to three years.

scholarly journals Anode Biofilm Transcriptomics Reveals Outer Surface Components Essential for High Density Current Production in Geobacter sulfurreducens Fuel Cells

PLoS ONE ◽  
2009 ◽  
Vol 4 (5) ◽  
pp. e5628 ◽  
Author(s):  
Kelly P. Nevin ◽  
Byoung-Chan Kim ◽  
Richard H. Glaven ◽  
Jessica P. Johnson ◽  
Trevor L. Woodard ◽  
...  
Keyword(s):  
Fuel Cells ◽  
Outer Surface ◽  
High Density ◽  
Geobacter Sulfurreducens ◽  
Density Current ◽  
Current Production
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