Amorphous silicon air-gap resonators on large-area substrates

2000 ◽  
Vol 77 (6) ◽  
pp. 907-909 ◽  
Author(s):  
M. Boucinha ◽  
P. Brogueira ◽  
V. Chu ◽  
J. P. Conde
Keyword(s):  
Air Gap ◽  
2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.


2003 ◽  
Vol 42 (Part 2, No. 11A) ◽  
pp. L1312-L1314 ◽  
Author(s):  
Akihiro Takano ◽  
Masayuki Tanda ◽  
Makoto Shimosawa ◽  
Takehito Wada ◽  
Tomoyoshi Kamoshita

2001 ◽  
Vol 685 ◽  
Author(s):  
M. Fernandes ◽  
Yu. Vygranenko ◽  
J. Martins ◽  
M. Vieira

AbstractWe suggest to enhance the performance of image acquisition systems based on large area amorphous silicon based sensors by optimizing the readout parameters such as the intensity and cross-section of scanner beam, acquisition time and bias conditions. The main output device characteristics as image responsivity, signal to noise ratio and spatial resolution were analyzed in open circuit, short circuit and photodiode modes. The result show that the highest signal to noise ratio and best dark to bright ratio can be achieved in short circuit mode.It was shown that the sensor resolution is related to the basic device parameters and, in practice, limited by the acquisition time and scanning beam properties. The scanning beam spot size limits the resolution due to the overlapping of dark and illuminated zones leading to a blurring effect on the final image and a consequent degradation in the resolution.


2005 ◽  
Vol 870 ◽  
Author(s):  
Subhendu Guha ◽  
Jeffrey Yang

AbstractLarge-area deposition of thin-film amorphous silicon alloy triple-junction solar cells on lightweight and flexible stainless steel substrate is described. The proprietary roll-to-roll operation enables continuous depositions of sophisticated multi-layer structures. The deposition methods include sputtering and plasma-enhanced chemical vapor depositions. Spectrumsplitting triple-junction solar cell design, manufacturing processes, and product applications are presented.


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