scholarly journals Temporal treatment of a thermal response for defect depth estimation

2000 ◽  
Author(s):  
Y. A. Plotnikov
Keyword(s):  
Thermal Response ◽  
Depth Estimation ◽  
Defect Depth

Defect Depth Quantification Using Pulsed Thermography

2012 ◽  
Vol 585 ◽  
pp. 72-76 ◽  
Author(s):  
D. Sharath ◽  
M. Menaka ◽  
B. Venkatraman
Keyword(s):  
Depth Estimation ◽  
Defect Size ◽  
Defect Depth ◽  
Pulsed Thermography ◽  
Full Field ◽  
First Derivative ◽  
Derivative Method ◽  
Aisi 316 ◽  
Materials Used ◽  
Defect Quantification

Pulsed Thermography is an advanced NDE technique which is becoming popular due to fast inspection rate, non contact nature and it gives full field image. Pulsed Thermography is successfully applied for defect detection, defect depth estimation, coating thickness evaluation and delamination detection in coatings but it is limited for evaluation of subsurface defects (of the order of few mm). In this paper we discuss the application of Pulsed Thermography for defect quantification and effect of defect size on it in AISI 316 grade SS which are important structural materials used in nuclear and other industries. Log First Derivative method is considered for defect depth quantification and the results are compared with Finite Difference Modeling carried out using ThermoCalc 6L software.

scholarly journals Analysis of time-resolved thermal responses in Lock-In thermography by independent component analysis (ICA) for a 3D-spatial separation of weak thermal sources and defects

2021 ◽  
Author(s):  
Michael Kögel ◽  
Sebastian Brand ◽  
Christian Große ◽  
Frank Altmann ◽  
Kristof J. P. Jacobs ◽  
...  
Keyword(s):  
Independent Component Analysis ◽  
Thermal Response ◽  
Spatial Separation ◽  
Depth Estimation ◽  
Sample Surface ◽  
Component Analysis ◽  
Independent Component ◽  
Time Resolved ◽  
Analysis Of Failures ◽  
Lock In

Abstract Lock-In Thermography is an established non-destructively operating method for the analysis of failures in microelectronic devices. In recent years a major improvement was achieved allowing the acquisition of the time-resolved temperature responses of weak thermal spots that enhances defect localization in 3D stacked semiconductor architectures. The assessment of a defect's depth based on the numerical estimation of the delay between excitation and thermal response by analyzing the value of the lock-in phase is often prone to thermal noise and parasitic effects. In sample structures that contain partial or full transparence for the infrared signal between the origin and the sample surface, the interference of the direct (radiated) and the conducted signal component largely falsifies the phase value on which the classical depth estimation relies. In the present study blind source separation based on independent component analysis of the thermal signals was successfully applied to separate interfering signal components arising from direct thermal radiation and conduction for a precise estimation of the defect depth.

scholarly journals An Analytical Model for Defect Depth Estimation Using Pulsed Thermography

2016 ◽  
Vol 56 (6) ◽  
pp. 1111-1122 ◽  
Author(s):  
S.L. Angioni ◽  
F. Ciampa ◽  
F. Pinto ◽  
G. Scarselli ◽  
D.P. Almond ◽  
...  
Keyword(s):  
Analytical Model ◽  
Depth Estimation ◽  
Defect Depth ◽  
Pulsed Thermography

scholarly journals Defect Depth Estimation in Infrared Thermography with Deep Learning

2021 ◽  
Author(s):  
Qiang Fang ◽  
farima abdollahi-mamoudan ◽  
Xavier Maldague
Keyword(s):  
Infrared Thermography ◽  
Low Cost ◽  
Depth Estimation ◽  
Defect Depth ◽  
Fem Modeling ◽  
Flat Bottom ◽  
Pulsed Thermography ◽  
And Performance ◽  
Gated Recurrent Units ◽  
Non Destructive

Infrared thermography has already been proven to be a significant method in non-destructive evaluation since it gives information with immediacy, rapidity, and low cost. However, the thorniest issue for the wider application of IRT is quantification. In this work, we proposed a specific depth quantifying technique by employing the Gated Recurrent Units (GRU) in composite material samples via pulsed thermography (PT). Finite Element Method (FEM) modeling provides the economic examination of the response pulsed thermography. In this work, Carbon Fiber Reinforced Polymer (CFRP) specimens embedded with flat bottom holes are stimulated by a FEM modeling (COMSOL) with precisely controlled depth and geometrics of the defects. The GRU model automatically quantified the depth of defects presented in the stimulated CFRP material. The proposed method evaluated the accuracy and performance of synthetic CFRP data from FEM for defect depth predictions.

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