Photopyroelectric thermal wave setup for the absolute measurement of the thermal conductivity of low density gases

2000 ◽  
Vol 71 (9) ◽  
pp. 3506-3512 ◽  
Author(s):  
J. Caerels ◽  
C. Glorieux ◽  
J. Thoen
Keyword(s):  
Thermal Conductivity ◽  
Thermal Wave ◽  
Absolute Measurement ◽  
Low Density ◽  
Wave Setup ◽  
The Absolute

scholarly journals Thermophysical Properties of Multifunctional Syntactic Foams Containing Phase Change Microcapsules for Thermal Energy Storage

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1790
Author(s):  
Francesco Galvagnini ◽  
Andrea Dorigato ◽  
Luca Fambri ◽  
Giulia Fredi ◽  
Alessandro Pegoretti
Keyword(s):  
Thermal Conductivity ◽  
Energy Storage ◽  
Phase Change ◽  
Epoxy Resin ◽  
Storage Modulus ◽  
Thermal Energy ◽  
Thermal Energy Storage ◽  
Neat Epoxy ◽  
Low Density ◽  
Syntactic Foams

Syntactic foams (SFs) combining an epoxy resin and hollow glass microspheres (HGM) feature a unique combination of low density, high mechanical properties, and low thermal conductivity which can be tuned according to specific applications. In this work, the versatility of epoxy/HGM SFs was further expanded by adding a microencapsulated phase change material (PCM) providing thermal energy storage (TES) ability at a phase change temperature of 43 °C. At this aim, fifteen epoxy (HGM/PCM) compositions with a total filler content (HGM + PCM) of up to 40 vol% were prepared and characterized. The experimental results were fitted with statistical models, which resulted in ternary diagrams that visually represented the properties of the ternary systems and simplified trend identification. Dynamic rheological tests showed that the PCM increased the viscosity of the epoxy resin more than HGM due to the smaller average size (20 µm vs. 60 µm) and that the systems containing both HGM and PCM showed lower viscosity than those containing only one filler type, due to the higher packing efficiency of bimodal filler distributions. HGM strongly reduced the gravimetric density and the thermal insulation properties. In fact, the sample with 40 vol% of HGM showed a density of 0.735 g/cm3 (−35% than neat epoxy) and a thermal conductivity of 0.12 W/(m∙K) (−40% than neat epoxy). Moreover, the increase in the PCM content increased the specific phase change enthalpy, which was up to 68 J/g for the sample with 40 vol% of PCM, with a consequent improvement in the thermal management ability that was also evidenced by temperature profiling tests in transient heating and cooling regimes. Finally, dynamical mechanical thermal analysis (DMTA) showed that both fillers decreased the storage modulus but generally increased the storage modulus normalized by density (E′/ρ) up to 2440 MPa/(g/cm3) at 25 °C with 40 vol% of HGM (+48% than neat epoxy). These results confirmed that the main asset of these ternary multifunctional syntactic foams is their versatility, as the composition can be tuned to reach the property set that best matches the application requirements in terms of TES ability, thermal insulation, and low density.

Thermal Conductivity of Low Density Polyethylene Foams Part I: Comprehensive Study of Theoretical Models

2019 ◽  
Vol 28 (4) ◽  
pp. 745-754 ◽  
Author(s):  
Hasanzadeh Rezgar ◽  
Azdast Taher ◽  
Doniavi Ali ◽  
Eungkee Lee Richard
Keyword(s):  
Thermal Conductivity ◽  
Theoretical Models ◽  
Low Density Polyethylene ◽  
Low Density ◽  
Comprehensive Study
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